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    COMPOSITE ELEMENTS OF THERMAL INSULATION MATERIAL, ADHESIVE AND OUTER LAYER
    8.
    发明专利
    COMPOSITE ELEMENTS OF THERMAL INSULATION MATERIAL, ADHESIVE AND OUTER LAYER 未知

    公开(公告)号：CA3091523A1

    公开(公告)日：2019-08-15

    申请号：CA3091523

    申请日：2019-01-30

    Applicant: BASF SE

    Inventor： JACOBMEIER OLAF ,  KRONIG SABRINA ,  HUSKOBLA ANTJE ,  RENNER CHRISTIAN ,  HUNTEMANN PETER

    IPC: C08G18/48 ,  B32B27/40 ,  C08G18/20 ,  C08G18/30 ,  C08G18/76 ,  C09J175/08 ,  E04C2/292

    Abstract: The present invention relates to a method for producing composite elements comprising thermal insulation material (B), adhesive (C), and optionally at least one outer layer (A), by bonding the thermal insulation material (B) with the adhesive (C), wherein the adhesive (C) is a polyurethane adhesive preparable by mixing polyisocyanates (a) with polyols (b) having at least two isocyanate-reactive groups, blowing agents (c), comprising water, and optionally chain extenders (d), catalysts (e), and other auxiliaries (f), where the polyols (b) comprise polyetherols and the polyetherols comprise 50 to 90 wt% of at least one polyalkylene oxide (b1) having a hydroxyl number of 120 to 300 mg KOH/g, based on a difunctional starter molecule, and an ethylene oxide fraction, based on the alkylene oxide content, of 60 to 100 wt%, and a fraction of primary OH groups of 50% to 100%, 10 to 50 wt% of at least one polyalkylene oxide (b2) having a hydroxyl number of 120 to 600 mg KOH/g, based on a difunctional and/or a trifunctional starter molecule, and an ethylene oxide fraction, based on the alkylene oxide content, of 0 to 40 wt%, and 0 to 30 wt% of at least one further polyalkylene oxide (b3) having a hydroxyl number of 100 to 800 mg KOH/g, based on a di- to tetrafunctional starter molecule, based in each case on the total weight of components (b1) to (b3). The present invention further relates to composite elements composed of thermal insulation material (B) and adhesive (C) and also, optionally, at least one outer layer (A), which are producible by such a method, and also to the use of the adhesive (C) for bonding thermal insulation materials (B).

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