-
公开(公告)号:WO2018215303A1
公开(公告)日:2018-11-29
申请号:PCT/EP2018/062964
申请日:2018-05-17
Applicant: BASF SE
Inventor: WAGNER, Sebastian , KNIESEL, Simon , LU, Wen , URBAN, Tobias , RICHTER, Frank
Abstract: The present invention relates to an article comprising a polymer body and a metal plating. In this article, the metal plating is attached to the polymer body and the polymer body comprises as components at least one polyamide (A), at least one filler (B), at least one poly-N-vinyllactam polymer (C) and, optionally, at least one additive (D). The present invention also relates to the process for producing this article and to the use of this article e.g. as door handle in automotive applications. Further, the present invention relates to the use of the polymer body for producing metal-plated articles.
-
公开(公告)号:WO2021069456A1
公开(公告)日:2021-04-15
申请号:PCT/EP2020/078026
申请日:2020-10-07
Inventor: LU, Wen , PARAPPUVEETIL SARANGADHARAN, Suresh , CHUANG, Fu, Chin
Abstract: The present invention disclosed to a polyamide composition, and an article which is ob- tained or obtainable from the polyamide composition, especially the connector socket for Double Data Rate (5) RAM. The polyamide composition of the present invention shows de- sirable tensile strength for the article with thin thickness of 0.4 mm, well flowability, high HDT which make it could be applied in electronic component with high work frequency. Mean- while, the composition also exhibits good thermal stability during molding, and approaches UL 94 V-0.
-
公开(公告)号:EP4041801A1
公开(公告)日:2022-08-17
申请号:EP20792557.9
申请日:2020-10-07
Applicant: BASF SE
Inventor: LU, Wen , PARAPPUVEETIL SARANGADHARAN, Suresh , CHUANG, Fu, Chin , CHEN, Lin
-
公开(公告)号:EP3631042A1
公开(公告)日:2020-04-08
申请号:EP18725826.4
申请日:2018-05-17
Applicant: BASF SE
Inventor: WAGNER, Sebastian , KNIESEL, Simon , LU, Wen , URBAN, Tobias , RICHTER, Frank
-
-
-