公开(公告)号：MY148352A

公开(公告)日：2013-03-29

申请号：MYPI20091458

申请日：2007-10-02

Applicant: BASF SE

Inventor： HIROKI FUKUHARA ,  ANDREAS EIPPER ,  CARSTEN WEIS ,  MARK VOELKEL ,  REINHARD STRANSKY ,  JENS ASMANN ,  MARTIN WEBER

IPC: C08K3/22

Abstract: THERMOPLASTIC MOLDING MATERIALS COMPRISING A) FROM 10 TO 69% BY WEIGHT OF A THERMOPLASTIC POLYESTER, B) FROM 30 TO 79% BY WEIGHT OF AN ALUMINUM OXIDE, C) FROM 0.01 TO 10% BY WEIGHT OF ALL ORGANIC OR INORGANIC ACID OR MIXTURES THEREOF, D) FROM 0 TO 10% BY WEIGHT OF D1) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYCARBONATE HAVING AN OH NUMBER OF FROM 1 TO 600 MG KOH/G OF POLYCARBONATE (TO DIN 53240. PART 2) OR D2) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYESTER OF THE AXBY TYPE WHERE X IS AT LEAST 1.1 AND Y IS AT LEAST 2.1 OR MIXTURES THEREOF, E) FROM 0 TO 50% BY WEIGHT OF FURTHER ADDITIVES. WHERE THE SUM OF THE PERCENTAGES BY WEIGHT OF COMPONENTS A) TO E) ADDS UP TO 100%.