公开(公告)号：WO2021245125A1

公开(公告)日：2021-12-09

申请号：PCT/EP2021/064762

申请日：2021-06-02

Applicant: BASF SE

Inventor： WEIDL, Christian, Hubert ,  ROESCH, Markus ,  TROPSCH, Juergen ,  MIRTSCHIN, Sebastian ,  WIEDEMANN, Alexandra ,  RATHS, Hans-Christian ,  SCHNEIDER, Bernd

IPC: C08G65/26 ,  C08F2/24 ,  C08G65/326 ,  C08G65/327 ,  C11D1/29 ,  C11D1/34 ,  C11D1/72 ,  C08F2/26 ,  C08G65/2612 ,  C11D1/345

Abstract: The presently claimed invention relates to the use of at least one compound of general formula (I) as an emulsifier or a stabilizer. The presently claimed invention further relates to the use of at least one compound of general formula (I) as an emulsifier or stabilizer in a polymerization reaction, preferably an emulsion polymerization. The presently claimed invention also relates to a method of emulsifying and/or stabilizing or dispersing liquids or solids in emulsion polymerization using at least one compound of general formula (I). Further, the presently claimed invention relates to a cleaning composition comprising at least one compound of general formula (I) and at least one additive.

公开(公告)号：WO2012016976A1

公开(公告)日：2012-02-09

申请号：PCT/EP2011/063276

申请日：2011-08-02

Applicant: BASF SE ,  SEELMANN-EGGEBERT, Hans-Peter ,  SENF, Andreas ,  ROESCH, Markus ,  BENTELE, Joachim ,  SCHMIDT, Kati ,  STEFANOWSKI, Udo

Inventor： SEELMANN-EGGEBERT, Hans-Peter ,  SENF, Andreas ,  ROESCH, Markus ,  BENTELE, Joachim ,  SCHMIDT, Kati ,  STEFANOWSKI, Udo

IPC: C10M107/30

CPC classification number: C10M107/34 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/061 ,  C10M2201/062 ,  C10M2209/104 ,  C10M2209/1045 ,  C10M2209/107 ,  C10N2220/022 ,  C10N2220/14 ,  C10N2230/02 ,  C10N2240/401 ,  C10M2209/1055 ,  C10M2209/1085 ,  C10M2209/1065

Abstract: Die Erfindung betrifft verbesserte neue Trägerflüssigkeiten für Abrasiva, insbesondere Schneidflüssigkeiten, zur Waferherstellung, ihre Verwendung und ein Verfahren zum Schneiden von Wafern.

Abstract translation: 本发明涉及改进的新的载体流体为磨料，特别是切削液体的晶圆制备，它们的用途和用于切割晶片的方法来。

公开(公告)号：EP4161984A1

公开(公告)日：2023-04-12

申请号：EP21728936.2

申请日：2021-06-02

Applicant: BASF SE

Inventor： WEIDL, Christian, Hubert ,  ROESCH, Markus ,  TROPSCH, Juergen ,  MIRTSCHIN, Sebastian ,  WIEDEMANN, Alexandra ,  RATHS, Hans-Christian ,  SCHNEIDER, Bernd

IPC: C08G65/26 ,  C08F2/24 ,  C08G65/326 ,  C08G65/327 ,  C11D1/29 ,  C11D1/34 ,  C11D1/72

公开(公告)号：EP2601280B1

公开(公告)日：2014-10-08

申请号：EP11738239.0

申请日：2011-08-02

Applicant: BASF SE

Inventor： SEELMANN-EGGEBERT, Hans-Peter ,  SENF, Andreas ,  ROESCH, Markus ,  BENTELE, Joachim ,  SCHMIDT, Kati ,  STEFANOWSKI, Udo

IPC: C10M107/30

CPC classification number: C10M107/34 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/061 ,  C10M2201/062 ,  C10M2209/104 ,  C10M2209/1045 ,  C10M2209/107 ,  C10N2220/022 ,  C10N2220/14 ,  C10N2230/02 ,  C10N2240/401 ,  C10M2209/1055 ,  C10M2209/1085 ,  C10M2209/1065

公开(公告)号：EP2601280A1

公开(公告)日：2013-06-12

申请号：EP11738239.0

申请日：2011-08-02

Applicant: BASF SE

Inventor： SEELMANN-EGGEBERT, Hans-Peter ,  SENF, Andreas ,  ROESCH, Markus ,  BENTELE, Joachim ,  SCHMIDT, Kati ,  STEFANOWSKI, Udo

IPC: C10M107/30

CPC classification number: C10M107/34 ,  C10M2201/041 ,  C10M2201/05 ,  C10M2201/061 ,  C10M2201/062 ,  C10M2209/104 ,  C10M2209/1045 ,  C10M2209/107 ,  C10N2220/022 ,  C10N2220/14 ,  C10N2230/02 ,  C10N2240/401 ,  C10M2209/1055 ,  C10M2209/1085 ,  C10M2209/1065

Abstract: The invention relates to improved novel carrier fluids for abrasives, especially cutting fluids, for wafer production. The invention also relates to the use of said fluids and to a method for cutting wafers.