THERMOPLASTIC MOULDING COMPOSITIONS HAVING IMPROVED DUCTILITY
    1.
    发明申请
    THERMOPLASTIC MOULDING COMPOSITIONS HAVING IMPROVED DUCTILITY 审中-公开
    具有改进的延性热塑性模塑材料

    公开(公告)号:WO2008074687A2

    公开(公告)日:2008-06-26

    申请号:PCT/EP2007063662

    申请日:2007-12-11

    Abstract: Thermoplastic moulding compositions comprising: A) from 40 to 96% by weight of a partly aromatic polyamide, B) from 2 to 30% by weight of a copolymer of B 1 ) from 35 to 89.9% by weight of ethylene, B 2 ) from 10 to 60% by weight of 1-octene or 1-butene or propylene or a mixture thereof and B 3 ) from 0.05 to 5% by weight of functional monomers selected from the group consisting of carboxylic acid, carboxylic anhydride, carboxylic ester, carboxamide, carboximide, amino, hydroxyl, epoxide, urethane and oxazoline groups and mixtures thereof, C) from 1 to 50% by weight of fibrous or particulate fillers or mixtures thereof, D) from 0.1 to 10% by weight of D 1 ) at least one highly branched or hyperbranched polycarbonate having an OH number of from 1 to 600 mg of KOH/g of polycarbonate (in accordance with DIN 53240, Part 2) or D 2 ) at least one highly branched or hyperbranched polyester of the A x B y type where x is at least 1.1 and y is at least 2.1 or a mixture thereof, E) from 0 to 15% by weight of an electrically conductive additive, F) from 0 to 30% by weight of further additives, where the sum of the percentages by weight of the components A) to F) is 100%.

    Abstract translation: 一种热塑性模塑组合物,包含:A)40乙的共聚物的96重量%的部分芳族聚酰胺的,B)2〜30重量%1 )35〜89.9重量%乙烯的, 乙 2 )10至60重量%的1-辛烯或1-丁烯或丙烯或它们的混合物和B 3 0.05 )至5重量%的官能 其中官能单体选自量羧酸,羧酸酐,羧酸酯,羧酰胺,羧酰亚胺,氨基,羟基,环氧基,氨基甲酸乙酯或恶唑啉基或它们的混合物的单体,C)1〜50 纤维状或颗粒状填料或其混合物的.-%物,D)为0.1至10重量ð的% 1 )至少一种高度支化或具有1至600毫克KOH的羟值超支化聚碳酸酯 2 )高(根据DIN 53240,第2部分),或至少一种/ g聚碳酸酯D或一个 X ý的超支化聚酯与 x至少为1.1,y是至少为2.1或 它们的混合物,E)0至15重量%的导电性添加剂的,F)0至30重量%的其它添加剂,其中百分数以重量计的组分A)到F)的总和为100%。

    Partially aromatic copolyamides with a high crystallinity

    公开(公告)号:AU2007222453A1

    公开(公告)日:2007-09-13

    申请号:AU2007222453

    申请日:2007-02-28

    Applicant: BASF SE

    Abstract: Semiaromatic semicrystalline thermoplastic polyamide molding compositions, comprising A) from 40 to 100% by weight of a copolyamide composed of a1) from 30 to 44 mol % of units which derive from terephthalic acid a2) from 6 to 20 mol % of units which derive from isophthalic acid a3) from 42 to 49.5 mol % of units which derive from hexamethylenediamine a4) from 0.5 to 8 mol % of units which derive from aromatic diamines having from 6 to 30 carbon atoms, where the molar percentages of components a1) to a4) together give 100%, and B) from 0 to 50% by weight of a fibrous or particulate filler C) from 0 to 30% by weight of an elastomeric polymer D) from 0 to 30% by weight of other additives and processing aids, where the percentages by weight of components A) to D) together give 100%.

    6.
    发明专利
    未知

    公开(公告)号:BRPI0720406A2

    公开(公告)日:2013-12-31

    申请号:BRPI0720406

    申请日:2007-12-11

    Applicant: BASF SE

    Abstract: Thermoplastic molding compositions comprising A) from 40 to 96% by weight of a semiaromatic polyamide, B) from 2 to 30% by weight of a copolymer composed of B1) from 35 to 89.9% by weight of ethylene, B2) from 10 to 60% by weight of 1-octene or 1-butene or propylene or a mixture of these, and B3) from 0.05 to 5% by weight of functional monomers, where the functional monomers have been selected from the group of the carboxylic acid groups, carboxylic anhydride groups, carboxylic ester groups, carboxamide groups, carboximide groups, amino groups, hydroxy groups, epoxy groups, urethane groups, or oxazoline groups, or a mixture of these, C) from 1 to 50% by weight of fibrous or particulate fillers, or a mixture of these, D) from 0.1 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these, E) from 0 to 15% by weight of an electrically conductive additive, F) from 0 to 30% by weight of further additives, where the total of the percentages by weight of components A) to F) is 100%.

    7.
    发明专利
    未知

    公开(公告)号:BRPI0708591A2

    公开(公告)日:2011-06-07

    申请号:BRPI0708591

    申请日:2007-02-28

    Applicant: BASF SE

    Abstract: Semiaromatic semicrystalline thermoplastic polyamide molding compositions, comprising A) from 40 to 100% by weight of a copolyamide composed of a1) from 30 to 44 mol % of units which derive from terephthalic acid a2) from 6 to 20 mol % of units which derive from isophthalic acid a3) from 42 to 49.5 mol % of units which derive from hexamethylenediamine a4) from 0.5 to 8 mol % of units which derive from aromatic diamines having from 6 to 30 carbon atoms, where the molar percentages of components a1) to a4) together give 100%, and B) from 0 to 50% by weight of a fibrous or particulate filler C) from 0 to 30% by weight of an elastomeric polymer D) from 0 to 30% by weight of other additives and processing aids, where the percentages by weight of components A) to D) together give 100%.

    COMPOSICIONES TERMOPLASTICAS PARA MOLDEAR QUE TIENEN DUCTILIDAD MEJORADA.

    公开(公告)号:ES2352999T3

    公开(公告)日:2011-02-24

    申请号:ES07857359

    申请日:2007-12-11

    Applicant: BASF SE

    Abstract: Composiciones termoplásticas para moldear que contienen A) 40 a 96 % en peso de una poliamida semi-aromática, B) 2 a 30 % en peso de un copolímero de B1) 35 a 89,9 % en peso de etileno, B2) 10 a 60 % en peso de 1-octeno o 1-buteno o sus mezclas y B3) 0,05 a 5 % en peso de monómeros funcionales, en cuyo caso los monómeros funcionales se seleccionan de El grupo de los ácido carboxílico, anhídrido de ácido carboxílico, ésteres de ácido carboxílico, amida de ácido carboxílico, imida de ácido carboxílico, grupos amino, hidroxilo, epóxido, uretano u oxalina o sus mezclas, C) 1 a 50 % en peso de material de carga en forma de fibras o de partículas o sus mezclas, D) 0,1 a10 % en peso de D1) al menos un policarbonato altamente o hiper-ramificado con un número de OH de 1 a 600 mg KOH/g de policarbonato (según DIN 53240, parte 2) o D2) al menos un poliéster altamente o hiper-ramificado del tipo AxBy donde x es igual a al menos 1,1 e y es igual a al menos 2,1 o sus mezclas, E) 0 a 15 % en peso de un aditivo conductor eléctrico, F) 0 a 30 % en peso de otros aditivos, en cuyo caso la suma de los porcentajes en peso de los componentes A) a F) da como resultado 100 %.

    COPOLIAMIDAS PARCIALMENTE AROMATICAS CON CRISTALINIDAD ELEVADA.

    公开(公告)号:ES2329309T3

    公开(公告)日:2009-11-24

    申请号:ES07712354

    申请日:2007-02-28

    Applicant: BASF SE

    Abstract: Masas de moldeo de poliamida parcialmente aromáticas, parcialmente cristalinas, termoplásticas, que contienen A) un 40 a un 100% en peso de una copoliamida constituida por a1) un 30 a un 44% en moles de unidades que se derivan de ácido tereftálico, a2) un 6 a un 20% en moles de unidades que se derivan de ácido isoftálico, a3) un 42 a un 49,5% en moles de unidades que se derivan de hexametilendiamina, a4) un 0,5 a un 8% en moles de unidades que de derivan de diaminas aromáticas con 6 a 30 átomos de carbono, dando por resultado conjuntamente un 100% los porcentajes molares de componentes a1) a a4), y B) un 0 a un 50% en peso de una carga en forma de fibras o partículas, C) un 0 a un 30% en peso de un polímero elástico tipo caucho, D) un 0 a un 30% en peso de otros aditivos y agentes auxiliares de elaboración, dando por resultado conjuntamente un 100% los porcentajes en peso de componentes A) a D).

    10.
    发明专利
    未知

    公开(公告)号:AT478926T

    公开(公告)日:2010-09-15

    申请号:AT07857359

    申请日:2007-12-11

    Applicant: BASF SE

    Abstract: Thermoplastic molding compositions comprising A) from 40 to 96% by weight of a semiaromatic polyamide, B) from 2 to 30% by weight of a copolymer composed of B1) from 35 to 89.9% by weight of ethylene, B2) from 10 to 60% by weight of 1-octene or 1-butene or propylene or a mixture of these, and B3) from 0.05 to 5% by weight of functional monomers, where the functional monomers have been selected from the group of the carboxylic acid groups, carboxylic anhydride groups, carboxylic ester groups, carboxamide groups, carboximide groups, amino groups, hydroxy groups, epoxy groups, urethane groups, or oxazoline groups, or a mixture of these, C) from 1 to 50% by weight of fibrous or particulate fillers, or a mixture of these, D) from 0.1 to 10% by weight of D1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, part 2), or D2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these, E) from 0 to 15% by weight of an electrically conductive additive, F) from 0 to 30% by weight of further additives, where the total of the percentages by weight of components A) to F) is 100%.

Patent Agency Ranking