USE OF THERMOPLASTIC MOLDING MATERIALS FOR GID/WIT

    公开(公告)号:MY150270A

    公开(公告)日:2013-12-31

    申请号:MYPI20102066

    申请日:2008-11-18

    Applicant: BASF SE

    Abstract: DISCLOSED IS THE USE OF THERMOPLASTIC MOLDING MATERIALS CONTAINING A) 10 TO 89 PERCENT BY WEIGHT OF A POLYETHYLENE TEREPHTHALATE THAT CAN CONTAIN UP TO 65 PERCENT BY WEIGHT OF ANOTHER POLYESTER, THE PERCENTAGE BEING RELATIVE TO 100 PERCENT BY WEIGHT OF A), B) 0.01 TO 50 PERCENT BY WEIGHT OF B1) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POYCARBONATE HAVING A HYDROXYL NUMBER OF 1 TO 600 MG OF KOH/g OF POLYCARBONATE (ACCORDING TO DIN 53240, PART 2), OR B2) AT LEAST ONE HIGHLY BRANCHED OR HYPERBRANCHED POLYESTER OF TYPE AxBy, WHEREIN x IS AT LEAST 1.1 AND y IS AT LEAST 2.1, OR THE MIXTURES THEREOF, C) 10 TO 60 PERCENT BY WEIGHT OF A FIBROUS OR PARTICULATE FILLER, D) 0 TO 20 PERCENT BY WEIGHT OF OTHER ADDITIVES, THE SUM OF THE PERCENTAGES BY WEIGHT OF COMPONENTS A) TO D) AMOUNTING TO 100 PERCENT, FOR PRODUCING MOLDED ARTICLES BY MEANS OF AN INTERNAL GAS PRESSURE PROCESS OR/AND A WATER INJECTION PROCESS.

Patent Agency Ranking