Abstract:
Thermoplastic moulding compounds comprising A) 10% to 98.95% by weight of at least one thermoplastic polyester, B) 0.05% to 30% by weight of at least one nanoparticulate oxide and/or oxide hydrate of at least one metal or semimetal, having a number-weighted average diameter of the primary particles of 0.5 to 50 nm and a hydrophobic particle surface, C) 1% to 60% by weight of at least one graft polymer, composed of c1) 20% to 80% by weight of a graft base which is composed of a rubber-elastic polymer based on alkyl acrylates having 1 to 8 C atoms in the alkyl radical and/or dienes having a glass transition temperature of below 10°C, c2) 20% to 80% by weight of a graft comprising c21) 60% to 95% by weight of styrene or substituted styrenes of the general formula I in which R is an alkyl radical having 1 to 8 C atoms or a hydrogen atom and R1 is an alkyl radical having 1 to 8 C atoms and n has a value of 1, 2 or 3, and c22) 5% to 40% by weight of at least one unsaturated nitrile, D) 0% - 60% by weight of further additives, the sum of the percentages by weight of components A) to D) making 100%.
Abstract:
The present invention relates to a method for the production of organosols containing at least one oxide and/or oxide hydrate of metals and/or semimetals, comprising the following steps: (a) providing an aqueous solution or dispersion of at least one starting compound containing at least one metal and/or semimetal M1, (b) bringing the aqueous solution or dispersion from step (a) in contact with at least one acidic substance, (c) extracting the aqueous solution or dispersion from step (b) using at least one organic solvent or dispersion medium (L) and (d) raising the pH of the organic phase from step (c) to at least 7. The present invention additionally relates to a method for producing particles from the organosols and to the use of the organosols for producing polymer compositions or polymer coatings.
Abstract:
Dispersions comprising functionalized metal oxide particles, polymerizable compounds and optionally a solvent, and the use thereof for stabilizing polymers.
Abstract:
The present invention relates to a method for producing transparent conductive oxides comprising the following steps in the sequence a-b-c: (a) Reacting at least one starting compound (A) containing at least one metal or semi-metal M and optionally a dopant (D) containing at least one doping element M', wherein at least one M' is not the same as M, in the presence of a block copolymer (B) and a solvent (C), forming a composite material (K), (b) optionally applying the composite material (K) onto a substrate (S) and (c) heating the composite material (K) to a temperature of at least 350°C, characterized in that the block copolymer (B) contains at least one alkylene oxide block (AO) and at least one isobutylene block (IB). The present invention also relates to transparent conductive oxides so obtained, use thereof in electronic components, as electrode materials and as material for antistatic applications. Finally, the present invention relates to electronic components containing the transparent conductive oxides.
Abstract:
Materiales de moldeo termoplásticos, que contienen A) del 10 al 99,999 % en peso de una poliamida, B) del 0,001 al 20 % en peso de polvo de hierro con un tamaño de partícula de como máximo 10 μm (valor d50), que puede obtenerse mediante descomposición térmica de pentacarbonilhierro y presenta una superficie BET específica de 0,1 a 5 m2/g de acuerdo con la norma DIN ISO 9277, C) del 0 al 70 % en peso de otros aditivos, dando como resultado la suma de los porcentajes en peso de los componentes A) a C) el 100 %.
Abstract:
The thermoelectric module composed of p- and n-conductive thermoelectric material legs which are connected to one another alternately via electrically conductive contacts is characterized in that at least some of the electrically conductive contacts on the cold and/or the warm side of the thermoelectric module are formed between, or embedded into, the thermoelectric material legs composed of porous metallic materials.
Abstract:
The invention relates to thermoplastic molding compounds comprising A) 10 to 99.999 wt % of a polyamide, B) 0.001 to 20 wt % of powdered iron having a particle size of no greater than 10 µm (d50 value) that can be obtained by thermally disintegrating iron pentacarbonyl, C) 0 to 70 wt % of further additives, wherein the sum of the weight percentages of the components A) to C) is 100%.