公开(公告)号：US11585004B2

公开(公告)日：2023-02-21

申请号：US17047500

申请日：2019-04-05

Applicant: BASF SE

Inventor： Marco Arnold ,  Chiao Chien Wei ,  Tzu Tsang Huang ,  Shih Ming Lin ,  Cheng Chen Kuo ,  Shih Wei Chou ,  Chieh Chu

IPC: C25D3/18 ,  C25D3/16 ,  C25D7/12 ,  H01L23/00

Abstract: A cobalt electroplating composition may include (a) cobalt ions; and (b) an ammonium compound of formula (NR1R2R3H+)nXn−, wherein R1, R2, R3 are independently H or linear or branched C1 to C6 alkyl, X is one or more n valent inorganic or organic counter ion(s), and n is an integer from 1, 2, or 3.