公开(公告)号：US3056015A

公开(公告)日：1962-09-25

申请号：US5974160

申请日：1960-09-30

Applicant: BENDIX CORP

Inventor： LOVELACE MONTE H

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: 948,531. Soldering. BENDIX CORPORATION. Sept. 19, 1961 [Sept. 30, 1960], No. 33539/61. Heading B3R. A dip-soldering device comprises means for passing current through a bath of molten solder and means for providing in the region of the bath a magnetic field such that its interaction with the electromagnetic field created by the current produces movement of the bath. A trough 11, Fig. 1, extending across a transport table comprising platforms 12, 13 has its ends closed by insulating blocks 15, 16 supporting electrodes 20, 21 which protrude into the ends of the trough, electrode 20 being connected to an A.C. or D.C. supply 23 by conductor 22 and electrode 21 connected to the supply by conductor 24 beneath the trough. Thermocouples 25, 26 in the trough maintain a constant bath temperature by regulating the applied voltage and fingers 30, 31 on arms 32, 33 sense the level of solder and operate switches in the circuit of a motor or motors, e.g. the motor 43 for feeding solder wire 41 into the trough. A similar solder supply may be provided at the other end of the trough. Fluxed printed circuit boards in carriers 51 are moved over the trough by a drive chain 50 and openings 65 in the platforms are supplied with heated air or nitrogen to pre-heat and postheat the circuit boards-the latter to allow gradual cooling. Current flows through the solder 80, Fig. 2, and returns via conductor 24, the current in the solder melting it and providing a convex meniscus 81 and also producing a flux in opposition to that produced by conductor 24, the force produced tending to rotate the molten solder. Alternatively, a resistance heater extending through the solder and supplied via conductor 24 primarily heats the solder and a small current is passed through the solder by electrodes at each end to produce a field in opposition to the return conductor field. The field produced by the return conductor may be provided alternatively by one or more permanent or electromagnets below the trough, permanent when A.C. is passed through the solder and A.C. electromagnets when D.C. is passed through the solder. In a modification, a quartz block 114, Fig. 3, has a hairpin-shaped trough 111 filled with solder 116 heated and agitated by current passed through the solder by electrodes 120, 121. The legs of solder roll in opposite directions. The solder level may be controlled by a photoelectric device.

公开(公告)号：US3316637A

公开(公告)日：1967-05-02

申请号：US47855165

申请日：1965-08-10

Applicant: BENDIX CORP

Inventor： LOVELACE MONTE H

IPC: B23D29/02

CPC classification number: B23D29/023

公开(公告)号：US3282137A

公开(公告)日：1966-11-01

申请号：US42227464

申请日：1964-12-30

Applicant: BENDIX CORP

Inventor： LOVELACE MONTE H

IPC: A61B17/28 ,  B25B7/08 ,  B25B7/12 ,  B25B9/02

CPC classification number: B25B9/02 ,  A61B17/2804 ,  B25B7/08 ,  B25B7/12