中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.023 seconds)

    SMALL FORM FACTOR PLUGGABLE OPTOELECTRONIC MODULES
    1.
    发明申请
    SMALL FORM FACTOR PLUGGABLE OPTOELECTRONIC MODULES 审中-公开
    小容量可插拔光电模块

    公开(公告)号：WO2004049014A3

    公开(公告)日：2006-06-22

    申请号：PCT/US0337509

    申请日：2003-11-20

    Applicant: BOOKHAM TECHNOLOGY PLC

    Inventor： EDWARDS PHILLIP J ,  LEBBY MICHAEL S ,  MEHTA SANJAY SHASHIKANT ,  SIMONEAUX CHRIS ,  VANDENBERG JOSEPH JOHN

    IPC: G02B6/42 ,  H01R13/24 ,  H01S5/022 ,  G02B6/00 ,  H01L33/00 ,  H04B10/00

    CPC classification number: G02B6/4292 ,  H01R12/52 ,  H01R13/2414

    Abstract: A small form factor pluggable optoelectronic module and pluggable equipment including an elongated optoelectronic module housing with first and second ends. The housing includes a cavity formed in the first end to nestingly receive one of a plurality of different optoelectronic modules in a horizontal-axis pluggable configuration. An electrical connector, which is one of a card edge connector and a multi-pin connector, is mounted in the housing adjacent the second end. An adapter is mounted in the housing to pluggably receive the one of the plurality of different optoelectronic modules and to electrically couple the one of the plurality of different optoelectronic modules to the electrical connector in a selected configuration.

    Abstract translation: 一种小型可插拔光电模块和可插拔设备，包括具有第一和第二端的细长光电子模块外壳。 壳体包括形成在第一端中以在水平轴可插拔构造中嵌套地接收多个不同光电子模块中的一个的空腔。 作为卡缘连接器和多针连接器之一的电连接器安装在与第二端相邻的壳体中。 适配器安装在壳体中以可插拔地接收多个不同光电子模块中的一个，并且以选定的配置将多个不同光电子模块中的一个电耦合到电连接器。

    OPTICAL COMPONENT MOUNTING AND INTERCONNECT APPARATUS
    2.
    发明申请
    OPTICAL COMPONENT MOUNTING AND INTERCONNECT APPARATUS 审中-公开
    光学元件安装和互连装置

    公开(公告)号：WO2004046766A3

    公开(公告)日：2004-12-29

    申请号：PCT/US0336930

    申请日：2003-11-19

    Applicant: BOOKHAM TECHNOLOGY PLC

    Inventor： AYLIFFE MICHAEL H ,  EDWARDS PHILLIP J ,  LEVIN BRADLEY S ,  MUSK ROBERT WILLIAM ,  VANDENBERG JOSEPH JOHN ,  ZABORSKY BRETT M

    IPC: G02B6/42 ,  H01S5/022 ,  H01L31/0203 ,  H01L23/48 ,  H01L31/00 ,  H01L31/0232

    CPC classification number: G02B6/4206 ,  G02B6/4201 ,  H01L2924/0002 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/0683 ,  H01L2924/00

    Abstract: Optoelectronic component mounting and interconnect apparatus is disclosed that includes an optoelectronic mounting plate with a substantially parallepiped-shaped base plate having opposed major surfaces and a mounting edge extending between the major surfaces. A plurality of electrical contact pads are positioned on one of the major surfaces and electrically insulated from each other. One of the electrical contact pads is designed to have an optoelectronic device physically and electrically mounted thereon. A support plate is physically attached to the mounting edge and has electrical traces connected to at least some of the electrical contact pads. An optoelectronic component with two electrical contacts is mounted on a first contact pad with one contact connected to the pad and a second contact connected to a second pad.

    Abstract translation: 公开了一种光电子部件安装和互连装置，其包括具有基本上并列形状的基板的光电安装板，其具有相对的主表面和在主表面之间延伸的安装边缘。 多个电接触垫定位在主表面中的一个上并彼此电绝缘。 电接触焊盘中的一个被设计成具有物理和电气安装在其上的光电子器件。 支撑板物理地附接到安装边缘并且具有连接到至少一些电接触垫的电迹线。 具有两个电触点的光电子部件安装在第一接触焊盘上，一个触点连接到焊盘，第二触点连接到第二焊盘。

    OPTICAL COMPONENT MOUNTING AND INTERCONNECT APPARATUS
    6.
    发明专利
    OPTICAL COMPONENT MOUNTING AND INTERCONNECT APPARATUS 未知

    公开(公告)号：AU2003295639A1

    公开(公告)日：2004-06-15

    申请号：AU2003295639

    申请日：2003-11-19

    Applicant: BOOKHAM TECHNOLOGY PLC

    Inventor： ZABORSKY BRETT M ,  AYLIFFE MICHAEL H ,  EDWARDS PHILLIP J ,  LEVIN BRADLEY S ,  MUSK ROBERT WILLIAM ,  VANDENBERG JOSEPH JOHN

    IPC: G02B6/42 ,  H01S5/022

    Abstract: Optoelectronic component mounting and interconnect apparatus is disclosed that includes an optoelectronic mounting plate with a substantially parallepiped-shaped base plate having opposed major surfaces and a mounting edge extending between the major surfaces. A plurality of electrical contact pads are positioned on one of the major surfaces and electrically insulated from each other. One of the electrical contact pads is designed to have an optoelectronic device physically and electrically mounted thereon. A support plate is physically attached to the mounting edge and has electrical traces connected to at least some of the electrical contact pads. An optoelectronic component with two electrical contacts is mounted on a first contact pad with one contact connected to the pad and a second contact connected to a second pad.

Patent Agency Ranking