公开(公告)号：SG175589A1

公开(公告)日：2011-11-28

申请号：SG2011072709

申请日：2007-09-21

Applicant: BREWER SCIENCE INC

Inventor： PILLALAMARRI SUNIL K ,  LI CHENGHONG

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a earner wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.FIGURE 1

公开(公告)号：WO2009003029A3

公开(公告)日：2009-04-30

申请号：PCT/US2008068170

申请日：2008-06-25

Applicant: BREWER SCIENCE INC ,  HONG WENBIN ,  PILLALAMARRI SUNIL K

Inventor： HONG WENBIN ,  PILLALAMARRI SUNIL K

IPC: H01L21/00

CPC classification number: H01L21/6835 ,  C09J5/06 ,  C09J2203/326 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T156/11 ,  Y10T428/24355

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract translation: 提供了使用这些组合物作为粘合组合物的新组合物和方法。 组合物优选是热塑性的，并且包括分散或溶解在溶剂体系中的酰亚胺，酰胺酰亚胺和/或酰胺酰亚胺 - 硅氧烷（以聚合或低聚形式），并且可用于将活性晶片结合到载体晶片或基底以辅助 在后续处理和处理期间保护活性晶片及其活性位点。 组合物形成化学和耐热的粘合层，但是也可以软化以使晶片在制造过程中的适当阶段分开。

公开(公告)号：EP2078306A4

公开(公告)日：2012-11-07

申请号：EP07843004

申请日：2007-09-21

Applicant: BREWER SCIENCE INC

Inventor： PILLALAMARRI SUNIL K ,  LI CHENGHONG

IPC: H01L21/304 ,  H01L21/683

CPC classification number: H01L21/6835 ,  B29B17/02 ,  B32B38/10 ,  B32B43/006 ,  C09J2205/302 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2924/30105 ,  Y10T156/11 ,  Y10T156/1153 ,  Y10T156/1168 ,  Y10T156/1189 ,  Y10T156/19 ,  Y10T156/1972 ,  Y10T428/31678

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions comprise a polymer dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract translation: 提供了新的组合物和使用那些组合物作为粘合组合物的方法。 该组合物包含分散或溶解在溶剂体系中的聚合物，并且可以被用来结合到有源晶片到载体晶片或基片，以协助保护活性晶片和随后的处理和操作过程中它的活性位点。 该组合物形成结合层确实是耐化学和耐热，但并因此可以被软化，以允许晶片在制造过程中的适当阶段相反的方向滑动。