Abstract:
PROBLEM TO BE SOLVED: To provide a heater unit which does not generate a gap due to the difference of coefficient of thermal expansion even if used in a high-temperature oxygen atmosphere and is suppressed of damages of an electrode and an electrode plate, and usable for a long period. SOLUTION: The heater unit includes a heater 3 made of silicon carbide, an electrode 5 which is conducted to the heater 3 to raise temperature and includes silicon carbide, an electrode plate 7 which is connected to a power source and includes an oxidation resistance material, a bolt 9 and a nut 11 which are made of silicon carbide, and a pair of washers 13 which are made of an oxidation resistance material and pinch the electrode 5 and the electrode plate 7. By using the bolt 9 and the nut 11, the washers 13, the electrode 5, and the electrode plate 7 are penetrated and pinched, thereby, the electrode 5 and the electrode plate 7 are combined. The electrode 5 and the washers 13 have the coefficient of thermal expansion larger than that of silicon carbide, and the thickness T3 of washers 13 in penetration direction x corresponds to a thickness in which the value of using electrode length (difference) ΔT subtracting the bolt expansion length ΔL is 0 mm or more and 0.03 mm or less. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a temperature measuring wafer and a temperature measuring method allowing an infrared radiation thermometer to more accurately measure a temperature of a wafer to be heated by a semiconductor heating device. SOLUTION: The semiconductor heating device 1, using the infrared radiation thermometer 40 measuring the temperature by measuring an intensity of infrared rays to be radiated from an object, measures the temperature of a temperature measuring wafer 20 containing a substrate 20a consisting of silicon carbide, and a reflection preventive film 20b formed on the surface of the substrate 20a, the reflection preventive film 20b consisting of silicon carbide and having surface roughness of Ra=0.8 μm or more. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramic heater for improving heat transfer capacity without changing external forms and regardless of the quality of a material. SOLUTION: The ceramic heater 1 includes: a heat generation body 2; and a hole 3 formed in the heat generation body 2. An inner surface 3a for demarcating the hole 3 is disposed opposite to an object H to be heated, and an opposing surface opposite to the object H to be heated is an inner surface 3a, thus increasing radiant heat toward the object H to be heated from the heat generation body 2 and improving a heating capacity. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a heater unit whose structure can be simplified while restraining increase of contact resistance and the occurrence of gas, and to provide an assembly structure of the same. SOLUTION: The heater unit 1, which supplies power to a heater 20 installed in a chamber 10 to make it generate heat and heats an object to be heated by heat generation of the heater 20, includes: electrode rods 30 made of silicon carbide integrally connected with the heater 20; and connector-type electrodes 40 electrically connected to a power source and fixed to the wall faces of a base member 10. Further, the connector-type electrodes 40 are equipped with concave parts 43, 53 capable of supporting the electrode rods 30 in an inserted state, and contact members 44, 54 made of Inconel in elastic contact with the electrode rods 30 inside the concave parts 43, 53. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a heater unit capable of heating a circuit board under the same condition as an actual reflow furnace and preferably adapted to the X-ray analysis of the heated circuit board. SOLUTION: The heater unit 10 is equipped with a heater 11 made of silicon carbide, an X-ray source 19a for emitting X rays in the direction of transmission through the heater 11 made of silicon carbide or the object S to be heated, which is heated by the heater 11 made of silicon carbide and the light receiving part 19b provided in the direction receiving the X rays emitted from the X-ray source 19a. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for manufacturing a liquid crystal display part with which the temperature of a large-sized liquid crystal display part can be quickly increased at a high temperature. SOLUTION: This device for manufacturing the liquid crystal display part which constitutes a liquid crystal display comprises a heater unit in which a plurality of heaters 1 containing a plate silicon carbide to heat the liquid crystal display part are arranged, controls individually each heater 1 of the heater unit, respectively, and increases the temperature of the liquid crystal display part to a predetermined temperature. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To improve the purity and equal heating property of a ceramic heater unit. SOLUTION: The ceramic heater unit (20) comprises at least a heater (1) and an electrode (2) for raising the temperature of the heater (1) by supplying electrical power to the heater (1). The heater (1) and the electrode (2) are formed of materials including silicon carbide. Moreover, the heater (1) and the electrode (2) are integrated with a joining material formed of a material including silicon carbide. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for adjusting the moisture of wood flooring, by which it is possible to maintain a moisture content within a specified range over a long period of time and control the generation of a dimensional change, a warpage or the like due to expansion/contraction by performing a secondary moisture adjustment of the initial moisture content without keeping the flooring in a moisture adjusting chamber for a long period of time. SOLUTION: This method for adjusting the moisture of the wood flooring 1 keeps the moisture content of the flooring 1 after moisture penetration within the range of 5 to 13% by secondarily depositing a wetting agent on the surface of the wood flooring 1 and thereby effecting the moisture penetration way deep inside the wood flooring 1. The wetting agent 2 is, for example, composed mainly of a sulfonic acid anionic surfactant. In addition, the wetting agent 2 is preferably deposited onto the wood flooring 1 by supplying the agent 2 to a pair of an upper and a lower sponge roller 3A and 3B and passing said flooring 1 between the rollers 3A and 3B. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a surface finish material which prevents warpage, a lift, a gap and the like from being generated and is highly durable, with regard to the surface finish material which has a woody feel and is used on the surfaces of flooring, a wall, a ceiling and the like or decorative surfaces of a pillar, furniture and the like and also is used on a variety of interior surfaces. SOLUTION: This surface finish material is structured of a base board (1) and a decorative board (2) laminated on the upper surface of a base board (1) the board (1) is made of a woody material. The board (2) is made of a synthetic resin material. Preferably, the base board (1) is made of a thermoplastic resin. Further, the lower surface of the base board (1) can be fluted or a substrate material (3) can be provided on the lower surface. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a structure and an execution method for a wiring floor, which can greatly heighten a degree of freedom of wiring and which enable a layout to be easily changed with rapidity. SOLUTION: The structure of the wiring floor is composed of a base panel (1) which has a recessed groove (4) for the wiring, a border panel (2) which is installed in a gap between the base panel (1) and a wall surface, and a floor covering material (3) which covers top surfaces of the base panel (1) and the border panel (2). The border panel (2) is formed with a pit (5) which houses the wiring on the downside of the material (3). In the execution method for the wiring floor, the base panel (1) and the border panel (2) are installed, the border panel (2) is grooved for a connection between the recessed groove (4) and the pit (5), the wiring is carried out through a worked groove (10), and the top surfaces are covered with the material (3).