公开(公告)号：US3634205A

公开(公告)日：1972-01-11

申请号：US3634205D

申请日：1968-09-27

Applicant: BUNKER RAMO

Inventor： MELILLO MANLIO B ,  VLACHOS DANIEL P

IPC: C25D3/38 ,  C23B5/48 ,  C23B5/20

CPC classification number: C25D3/38 ,  Y10S205/92

Abstract: A high-speed electrolytic copper plating bath containing an aqueous solution of copper fluoborate and fluoboric acid, and optionally, an alkali metal fluoride and a surface active agent is disclosed. With this bath, a smooth and ductile copper layer can be substantially evenly deposited onto the surfaces of an apertured object such as a printed circuit board.

Abstract translation: 公开了含有氟硼酸铜和氟硼酸水溶液的高速电解铜电镀液，以及任选的碱金属氟化物和表面活性剂。 通过该浴，可以将光滑的延性铜层基本上均匀地沉积到诸如印刷电路板的有孔物体的表面上。