公开(公告)号：WO2019152340A1

公开(公告)日：2019-08-08

申请号：PCT/US2019/015518

申请日：2019-01-29

Applicant: BUTTERFLY NETWORK, INC.

Inventor： FIFE, Keith, G. ,  LIU, Jianwei ,  BETTS, Andrew

IPC: A61B8/00 ,  H01L21/48 ,  H01L21/768 ,  H01L31/08

Abstract: Aspects of the disclosure described herein related to packaging an ultrasound-on-a- chip. In some embodiments, an apparatus includes an ultrasound-on-a-chip that has through- silicon vias (TSVs) and an interposer coupled to the ultrasound-on-a-chip and including vias, where the ultrasound-on-a-chip is coupled to the interposer such that the TSVs in the ultrasound-on-a-chip are electrically connected to the vias in the interposer. In some embodiments, an apparatus includes an ultrasound-on-a-chip having bond pads, an interposer that has bond pads and that is coupled to the ultrasound-on-a-chip, and wirebonds extending from the bond pads on the ultrasound-on-a-chip to the bond pads on the interposer.