公开(公告)号：WO2015035890A1

公开(公告)日：2015-03-19

申请号：PCT/CN2014/086032

申请日：2014-09-05

Applicant: BYD COMPANY LIMITED

Inventor： LI, Yonghui ,  ZHU, Shuhua ,  ZHANG, Siquan ,  LI, Qian ,  KONG, Xianjun ,  CHEN, Dajun

IPC: H01Q1/38

CPC classification number: H01Q1/38 ,  H01Q1/243

Abstract: A method for manufacturing an antenna, an antenna and a mobile terminal are provided. The method inlcudes: providing a laser-activable plastic substrate； forming at least four micro via holes at a predetermined position of the plastic substrate by laser； activating antenna regions of a first surface and a second surface of the plastic substrate by laser； and chemical plating the plastic substrate to form a first metal layer on the antenna region of the first surface, a second metal layer on the antenna region of the second surface, and a metal pillar in at least one micro via hole for connecting the first metal layer and the second metal layer.

Abstract translation: 提供一种制造天线，天线和移动终端的方法。 该方法包括：提供可激光激活的塑料基板; 通过激光在所述塑料基板的预定位置处形成至少四个微通孔; 通过激光激活塑料基板的第一表面和第二表面的天线区域; 以及化学电镀所述塑料基板以在所述第一表面的天线区域上形成第一金属层，在所述第二表面的天线区域上形成第二金属层，以及在至少一个微通孔中的金属柱，用于将所述第一金属 层和第二金属层。

公开(公告)号：EP4166869A1

公开(公告)日：2023-04-19

申请号：EP21827078.3

申请日：2021-06-07

Applicant: BYD Company Limited

Inventor： LI, Yonghui ,  LI, Junqiao ,  ZHOU, Wei

IPC: F25B21/02

Abstract: A semiconductor refrigeration chip and a method for manufacturing same are provided. The method includes: providing a semiconductor refrigeration assembly, where the semiconductor refrigeration assembly includes a first insulating and heat-conducting layer and a second insulating and heat-conducting layer provided opposite to each other and a semiconductor layer arranged between the first insulating and heat-conducting layer and the second insulating and heat-conducting layer, a side of the semiconductor refrigeration assembly provided with the first insulating and heat-conducting layer is a cold end, and a side of the semiconductor refrigeration assembly provided with the second insulating and heat-conducting layer is a hot end; and forming a packaging structure, and causing the packaging structure to cover a side wall of the semiconductor refrigeration assembly and define a first groove with the first insulating and heat-conducting layer, to obtain the semiconductor refrigeration chip.