公开(公告)号：US11649528B2

公开(公告)日：2023-05-16

申请号：US16960080

申请日：2018-12-24

Applicant: BYD COMPANY LIMITED

Inventor： Qing Gong ,  Qiang Guo ,  Mengde Wang ,  Wei An

IPC: C22C9/05 ,  C22C30/02 ,  B22D17/00 ,  C22C1/02 ,  H04M1/02

CPC classification number: C22C9/05 ,  B22D17/007 ,  C22C1/02 ,  C22C30/02 ,  H04M1/026

Abstract: The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.

公开(公告)号：US11174533B2

公开(公告)日：2021-11-16

申请号：US16627882

申请日：2018-07-02

Applicant: BYD COMPANY LIMITED

Inventor： Qiang Guo ,  Mengde Wang ,  Wei An

IPC: C22C9/05 ,  C22C1/02

Abstract: The disclosure relates to a Cu-based microcrystal alloy and a preparation method thereof. Through being measured in percentage by mass, the Cu-based microcrystal alloy provided by the disclosure includes 20 to 30 percent of Mn, 0.01 to 10 percent of Al, 5 to 10 percent of Ni, 0.3 to 1.5 percent of Ti, 0 to 1.5 percent of Zr, 0.05 to 2 percent of Si and 45 to 74.64 percent of Cu.