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公开(公告)号：EP3858603A1
公开(公告)日：2021-08-04
申请号：EP19866304.9
申请日：2019-09-10
Applicant: BYD Company Limited
Inventor： LIAN, Junlan , LIN, Hongye , CHEN, Fan , LI, Weitu
Abstract: The present invention relates to a metal resin composite and a preparation method thereof, and an electronic product housing prepared by using the metal resin composite. The metal resin composite includes: a metal substrate; a metal layer formed on a surface of the metal substrate, and a plurality of microcracks formed at a surface of the metal layer; and a resin layer formed on the metal layer.
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