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公开(公告)号：EP3860319A1
公开(公告)日：2021-08-04
申请号：EP19866630.7
申请日：2019-05-16
Applicant: BYD Company Limited
Inventor： MA, Lan , JIN, Haiyan , PAN, Ling , YU, Na , CHEN, Liang
IPC: H05K5/02
Abstract: An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.
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