公开(公告)号：EP4414335A1

公开(公告)日：2024-08-14

申请号：EP22880122.1

申请日：2022-09-22

Applicant: BYD Company Limited

Inventor： CUI, Jingna ,  ZHANG, Jiaxin ,  PEI, Yulei ,  WU, Shuang ,  GAI, Qiying

IPC: C03C21/00 ,  C03B27/00

CPC classification number: C03B27/00 ,  C03C21/00

Abstract: A glass substrate and a method for preparing the same, and an electronic device are provided, two opposite sides of the glass substrate respectively have a first surface compressive stress layer and a second surface compressive stress layer. A surface compressive stress of the first surface compressive stress layer is greater than a surface compressive stress of the second surface compressive stress layer, and a depth of the first surface compressive stress layer is less than a depth of the second surface compressive stress layer.

公开(公告)号：EP4345078A1

公开(公告)日：2024-04-03

申请号：EP22874764.8

申请日：2022-09-22

Applicant: BYD Company Limited

Inventor： PEI, Yulei ,  WU, Shuang ,  GAI, Qiying ,  CUI, Jingna ,  ZHANG, Jiaxin

IPC: C03C21/00

Abstract: The present disclosure provides a strengthened glass and a glass strengthening method, and an electronic device housing. Two opposing sides of the strengthened glass have surface compressive stress layers, and a third stress layer is sandwiched between the two surface compressive stress layers. The third stress layer includes a compressive stress region (32) and multiple tensile stress regions (40) spaced apart within the compressive stress region (32), the multiple tensile stress regions (40) are arranged in a thickness direction perpendicular to the strengthened glass, and each of the tensile stress regions (40) is surrounded by the compressive stress region (32). A sum of depths of the surface compressive stress layers and a depth of the compressive stress region (32) located between two adjacent tensile stress regions (40) is equal to a thickness of the strengthened glass.