公开(公告)号：EP3564988A1

公开(公告)日：2019-11-06

申请号：EP17885508.6

申请日：2017-12-08

Applicant: BYD Company Limited

Inventor： LIAN, Junlan ,  XIONG, Yijing ,  LIN, Hongye

IPC: H01L23/14 ,  H01L23/373 ,  H01L23/498 ,  H01L21/48

Abstract: This disclosure relates to the field of heat dissipation substrates for encapsulating electronic devices, and discloses a heat dissipation substrate, a method for preparing same, an application of same, and an electronic device. The heat dissipation substrate includes: a metal-ceramic composite board, where the metal-ceramic composite board is a metal layer wrapping a ceramic body; a metal oxide layer integrated with the metal layer and formed on an outer surface of the metal layer; and a soldering metal layer formed on at least a part of an outer surface of the metal oxide layer, where the soldering metal layer is used to connect with a copper substrate and bear a chip.