公开(公告)号：WO2010090928A2

公开(公告)日：2010-08-12

申请号：PCT/US2010/022312

申请日：2010-01-28

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： PALANISAMY CHINNATHAMBI, Selvaraj ,  SIRIWARDANE, Haresh

IPC: C09K3/14

CPC classification number: C09K3/1463 ,  C09G1/02

Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel phosphorous, oxalic acid, optionally, tartaric acid, optionally, a nonionic surfactant, optionally, a biocide, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.

Abstract translation: 本发明提供一种化学机械抛光组合物，其包含α氧化铝，热解氧化铝，二氧化硅，氧化镍磷的氧化剂，草酸，任选的酒石酸，任选的非离子表面活性剂，任选的杀生物剂和水。 本发明还提供了一种对基材进行化学机械抛光的方法，包括使基底与抛光垫和化学机械抛光组合物接触，使抛光垫和抛光组合物相对于基底移动，并研磨至少部分 底物抛光底物。

公开(公告)号：WO2013177251A1

公开(公告)日：2013-11-28

申请号：PCT/US2013/042168

申请日：2013-05-22

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： PALANISAMY CHINNATHAMBI, Selvaraj ,  SIRIWARDANE, Haresh

IPC: B24B37/04 ,  B24B57/02 ,  H01L21/304

CPC classification number: C09K3/1463 ,  B81C2201/0104 ,  H01L21/30625 ,  H01L21/3212

Abstract: The invention provides a chemical-mechanical polishing composition containing wet-process silica, an oxidizing agent that oxidizes nickel-phosphorous, a chelating agent, polyvinyl alcohol, and water. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.

Abstract translation: 本发明提供一种含有湿法二氧化硅，氧化镍磷的氧化剂，螯合剂，聚乙烯醇和水的化学机械抛光组合物。 本发明还提供了一种通过使基底与抛光垫和化学机械抛光组合物接触来对基底，特别是镍 - 磷基底进行化学机械抛光的方法，相对于基底移动抛光垫和抛光组合物， 并研磨基底的至少一部分以抛光基底。

公开(公告)号：WO2015137982A1

公开(公告)日：2015-09-17

申请号：PCT/US2014/029518

申请日：2014-03-14

Applicant: CABOT MICROELECTRONICS CORPORATION

Inventor： LAU, Hon Wu ,  SIRIWARDANE, Haresh

IPC: B24B37/24 ,  B24B37/22

CPC classification number: B24B37/044

Abstract: The invention provides a chemical-mechanical polishing composition containing (a) abrasive particles, (b) a polymer, and (c) water, wherein (i) the polymer possesses an overall charge, (ii) the abrasive particles have a zeta potential Z a measured in the absence of the polymer and the abrasive particles have a zeta potential Z b measured in the presence of the polymer, wherein the zeta potential Z a is a numerical value that is the same sign as the overall charge of the polymer, and (iii) | zeta potential Z b | > | zeta potential Z a |. The invention also provides a method of polishing a substrate with the polishing composition.

Abstract translation: 本发明提供一种化学机械抛光组合物，其包含（a）磨料颗粒，（b）聚合物和（c）水，其中（i）聚合物具有总电荷，（ii）磨料颗粒具有ζ电位Za 在不存在聚合物的情况下测量，并且磨料颗粒在聚合物存在下测量的ζ电位Zb，其中ζ电位Za是与聚合物的总电荷相同的数值，（iii） | ζ电位Zb | > | ζ电位Za |。 本发明还提供了用抛光组合物抛光衬底的方法。

公开(公告)号：WO2010141652A2

公开(公告)日：2010-12-09

申请号：PCT/US2010/037158

申请日：2010-06-03

Applicant: CABOT MICROELECTRONICS CORPORATION ,  PALANISAMY CHINNATHAMBI, Selvaraj ,  SIRIWARDANE, Haresh

Inventor： PALANISAMY CHINNATHAMBI, Selvaraj ,  SIRIWARDANE, Haresh

IPC: H01L21/304

CPC classification number: G11B5/8404 ,  C09G1/02 ,  C09K3/1409 ,  C09K3/1463 ,  C23F1/14 ,  G11B23/505

Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel phosphorous, a complexing agent, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.

Abstract translation: 本发明提供一种化学机械抛光组合物，其包含α氧化铝，热解氧化铝，二氧化硅，氧化镍磷的氧化剂，络合剂和水。 本发明还提供了一种对基材进行化学机械抛光的方法，包括使基底与抛光垫和化学机械抛光组合物接触，使抛光垫和抛光组合物相对于基底移动，并研磨至少部分 底物抛光底物。