公开(公告)号：EP1019937A4

公开(公告)日：2005-05-04

申请号：EP98906245

申请日：1998-02-11

Applicant: CANDESCENT INTELLECTUAL PROP

Inventor： WILLIAMS DALE A

IPC: H01J9/02

CPC classification number: H01J9/025

Abstract: A method for removing a lift-off layer (214) and an overlying closure layer (218) formed during manufacture of a field emitter structure having at least one emitter (220) on a substrate (202) comprising: a) immersing the field emitter structure in an etchant which attacks the lift-off layer (214) and b) activating a vibrational transducer (410) immersed in the etchant to subject the lift-off and closure layers to vibrational forces which aid in removing these layers (214, 218) from the emitter structure (210, 206, 220). The transducer (410) is preferably a megasonic transducer. After rinsing etchant from the emitter structure, the emitter structure may be dried using an alcohol-based fluid displacement drying process.