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公开(公告)号:WO2003015118A2
公开(公告)日:2003-02-20
申请号:PCT/US2002/024462
申请日:2002-08-02
Applicant: CANDESCENT TECHNOLOGIES CORPORATION
Inventor: LEE, Jueng-Gil , FAHLEN, Theodore, S.
IPC: H01J9/00
CPC classification number: H01J9/32 , H01J9/261 , H01J2209/268
Abstract: A method for attaching a faceplate and a backplate of a field emission display device.Specifically, one embodiment of the present invention discloses a method for protecting asilicon nitride passivation layer from reacting with a glass frit sealing material that contains lead oxide during an oven sealing or laser sealing process. The passivation layer protectsrow and column electrodes in the display device. A barrier material fully encapsulates the silicon nitride passivation layer. In one embodiment, silicon dioxide is the barrier material.In another embodiment, spin-on-glass is the barrier material. In still another embodiment, cermet is the barrier material.
Abstract translation: 一种用于附接场致发射显示装置(200)的面板和背板(205)的方法。 具体地,本发明的一个实施例公开了一种用于保护氮化硅钝化层(290)与在炉密封或激光密封过程(350)期间含有氧化铅的玻璃密封件密封材料(260)的反应。 钝化层(290)保护显示装置(200)中的行和列电极(220,230)。 阻挡材料(280)完全封装氮化硅钝化层(290)。 在一个实施例中,二氧化硅是阻挡材料(280)。 在另一个实施方案中,旋涂玻璃是阻挡材料(280)。 在另一个实施方案中,金属陶瓷是阻挡材料(280)。
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公开(公告)号:WO2003030202A1
公开(公告)日:2003-04-10
申请号:PCT/US2002/029393
申请日:2002-09-16
Applicant: CANDESCENT TECHNOLOGIES CORPORATION
Inventor: LEE, Jueng-Gil , BONN, Matthew, A.
IPC: H01J9/02
CPC classification number: H01J9/025
Abstract: A method of forming a field emission display device comprising a gate layer (MG1), an interlayer dielectric (ILD1) separating the gate and cathode electrode (M1) comprising forming a blanket layer of polycarbonate over the gate layer implanted with ion tracks to form a mask, and etching the gate layer and cathode cavity (T1) with an etchant comprising, octafluorocyclobutane, that is selective with respect to silicon dioxide (ILD1) so that a silicon nitride passivation layer (PA2) need not be protected by another passivation layer prior to the etching step.
Abstract translation: 一种形成场致发射显示装置的方法,包括栅极层MG1,分离栅极和阴极电极M1的层间电介质ILD1,包括在注入离子轨迹的栅极层上形成聚碳酸酯的覆盖层以形成掩模,并蚀刻栅极 具有包括八氟环丁烷的蚀刻剂的层和阴极腔T1,其相对于二氧化硅ILD1是选择性的,使得氮化硅钝化层PA2在蚀刻步骤之前不需要被另一钝化层保护。
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