公开(公告)号：WO2017218158A1

公开(公告)日：2017-12-21

申请号：PCT/US2017/034485

申请日：2017-05-25

Applicant: CASCADE MICROTECH, INC.

Inventor： SALMON, Jay ,  SWART, Roy, E. ,  LIEW, Brandon

IPC: G01R1/073 ,  G01R31/02 ,  G01R31/28

CPC classification number: G01R31/2887 ,  G01R1/07378

Abstract: Probe head assemblies and probe systems for testing integrated circuit devices are disclosed herein. In one embodiment, the probe head assemblies include a contacting structure and a space transformer assembly, in another embodiment, the probe head assemblies include a contacting structure, a suspension system, a flex cable interface, and a space transformer including a space transformer body and a flex cable assembly. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, and a planarization layer. In another embodiment, the probe head assemblies include a contacting structure, a space transformer, a suspension system, a platen, a printed circuit board, a first plurality of signal conductors configured to convey a first plurality of signals external to the space transformer, and a second plurality of signal conductors configured to convey a second plurality of signals via the space transformer. The probe systems include the probe head assemblies.

Abstract translation: 这里公开了用于测试集成电路器件的探针头组件和探针系统。 在一个实施例中，探头组件包括接触结构和空间变换器组件。在另一个实施例中，探头组件包括接触结构，悬挂系统，柔性电缆接口以及包括空间变换器主体的空间变换器和 柔性电缆组件。 在另一个实施例中，探头组件包括接触结构，空间变换器和平坦化层。 在另一个实施例中，探针头组件包括接触结构，空间变换器，悬架系统，台板，印刷电路板，第一多个信号导体，第一多个信号导体被配置为将第一多个信号传送到空间变换器的外部，以及 第二多个信号导体，被配置为经由所述空间变换器传送第二多个信号。 探头系统包括探头组件。

公开(公告)号：WO2017196830A1

公开(公告)日：2017-11-16

申请号：PCT/US2017/031730

申请日：2017-05-09

Applicant: CASCADE MICROTECH, INC.

Inventor： SWART, Roy, E. ,  SALMON, Jay ,  LIEW, Brandon

IPC: H05K3/32 ,  B81B7/00 ,  B81C1/00 ,  G01R1/02 ,  G01R1/04 ,  G01R1/073 ,  G01R31/02

CPC classification number: H01F27/2804 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2889 ,  H01F41/041 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/10378

Abstract: Space transformers, planarization layers for space transformers, methods of fabricating space transformers, and methods of planarizing space transformers are disclosed herein. In one embodiment, the space transformers include a space transformer assembly including a first rigid space transformer layer, a second rigid space transformer layer, and an attachment layer that extends between the first rigid space transformer layer and the second rigid space transformer layer. In another embodiment, the space transformers include a space transformer body and a flex cable assembly. The planarization layer includes an interposer, a resilient dielectric layer, a planarized rigid dielectric layer, a plurality of holes, and an electrically conductive paste extending within the plurality of holes. In one embodiment, the methods include methods of fabricating the space transformer assembly. In another embodiment, the methods include methods of planarizing a space transformer.

Abstract translation: 本文公开了用于空间变换器的空间变换器，平坦化层，制造空间变换器的方法以及平面化空间变换器的方法。 在一个实施例中，空间变换器包括空间变换器组件，其包括第一刚性空间变换器层，第二刚性空间变换器层以及在第一刚性空间变换器层和第二刚性空间变换器层之间延伸的附接层。 在另一个实施例中，空间变换器包括空间变换器本体和柔性电缆组件。 平坦化层包括内插器，弹性介电层，平坦化刚性介电层，多个孔以及在多个孔内延伸的导电膏。 在一个实施例中，该方法包括制造空间变换器组件的方法。 在另一个实施例中，这些方法包括平坦化空间变换器的方法。