公开(公告)号：JP2001013168A

公开(公告)日：2001-01-19

申请号：JP2000167610

申请日：2000-06-05

Applicant: CASCADE MICROTECH INC

Inventor： REED GLEASON ,  MICHAEL A BAIN ,  KENNETH SMITH

IPC: G01R31/26 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To increase horizontal strength so as to form a proper alignment by arranging a conductive material inside a pressing part, eliminating an excessive part from a dielectric layer upper face, arranging a flat plane over the whole and eliminating a base board after patterning a track on the dielectric layer and the conductive material. SOLUTION: A polyimide layer 220 and a base board 200 is plated with a conductive material 250 by electrical plating, and the conductive material 250 such as nickel and rhodium is provided in a pressing part. Then, an excessive part of the conductive material 250 is removed from the upper face of the polyimide layer 22, and lapping is carried out for arranging a flat surface over the whole. A track 252 is patterned on the polyimide layer 220 and the conductive material 250 so as to be turned into an excellent conductor such as copper, aluminum, and gold. Subsequently, the base board 200 is removed by etching using hydrochloric acid or sulfonic acid.