公开(公告)号：JPH1126527A

公开(公告)日：1999-01-29

申请号：JP16084098

申请日：1998-06-09

Applicant: CASCADE MICROTECH INC

Inventor： PAUL A TELVEAU ,  COWAN CLARENCE E

IPC: D01G15/00 ,  G01R1/067 ,  G01R1/073 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To enhance the insulation between traces where stressed leak currents appear and suppress the crosstalk between trace sets by electrically connecting guard traces having a top surface shape of a card to auxiliary guard traces at a set of conductor pairs formed through a top dielectric layer. SOLUTION: A laminate board 158 includes a top dielectric layer, bottom dielectric and guide traces 204 disposed between the top and bottom dielectric layers and has an opening 166 and top and bottom main surfaces. The probe device comprises a probe needle 164 and electric contact electrically connected to the needle 164 and is disposed on the top main surface on which the probe devices are radially disposed with respect to the opening 166 and extends down below the opening 166. Pogo-pin accepting pad sets 170, first conductors for electrically connecting the sets 170 to the guard traces 204 and second conductors for connecting electric contacts to the sets 170 are provided.