公开(公告)号：JP2011034737A

公开(公告)日：2011-02-17

申请号：JP2009178472

申请日：2009-07-30

Applicant: Casio Computer Co Ltd ,  カシオ計算機株式会社

Inventor： KUMAGAI MINORU

IPC: H05B33/10 ,  B05B1/34 ,  H01L51/50

Abstract: PROBLEM TO BE SOLVED: To provide a coating device capable of stabilizing flow of ink. SOLUTION: A nozzle plate Np is pressed from above by a pressing ring 91. On the pressing ring 91, a filter 84 is set, and the filter 84 is fixed inside a head cylinder 81 by a pressing ring 92. The nozzle plate Np includes a rectangular nozzle Nz, as seen from an ink-supplying side. Since the nozzle Nz is rectangular, ink is discharged with its cross section rectangular, and has its cross-section shape changed due to surface tension. Here, the ink swirls to have its flow stabilized, and a liquid column Lp is maintained. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供能够稳定墨水流动的涂布装置。 解决方案：通过压环91从上方挤压喷嘴板Np。在压环91上设置过滤器84，并且过滤器84通过按压环92固定在头缸81内。喷嘴 板Np包括从供墨侧看的矩形喷嘴Nz。 由于喷嘴Nz是矩形的，所以油墨的横截面为矩形排出，并且其横截面形状由于表面张力而改变。 这里，油墨旋转使其流动稳定，保持液柱Lp。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2011014346A

公开(公告)日：2011-01-20

申请号：JP2009156801

申请日：2009-07-01

Applicant: Casio Computer Co Ltd ,  カシオ計算機株式会社

Inventor： KIZU TAKASHI ,  KUMAGAI MINORU

IPC: H05B33/10 ,  H01L51/50

Abstract: PROBLEM TO BE SOLVED: To reduce film-forming defects of a carrier transport layer.SOLUTION: A mask M has an opening 31 of which a coating region R1 is exposed, a frame 32 to cover a non-coating region R2, and a slope 33 which inclines on the opening 31 side in the frame 32 and toward the lower part on the opening 31 side from the upper part of the frame 32. The frame 32 of the mask M is arranged superposed in the non-coating region R2 of a substrate 10, and a liquid body L is coated by a nozzle print method, in which a nozzle N is moved relatively, from the coating region R1 in the opening 31 of the mask M toward the slope 33 of the frame 32 and from the slope 33 of the frame 32 toward the coating region R1 in the opening 31. Thereby, generation of meniscus of the liquid body L at the boundary of the coating region R1 and the non-coating region R2 is suppressed, and defects of film-forming of the carrier transport layer are reduced.

Abstract translation: 要解决的问题：减少载流子传输层的成膜缺陷。解决方案：掩模M具有露出涂层区域R1的开口31，覆盖非涂覆区域R2的框架32和斜面 33，其从框架32的上部在框架32中的开口31侧倾斜并且朝向开口31侧的下部倾斜。掩模M的框架32重叠设置在框架32的非涂覆区域R2中 衬底10和液体L通过喷嘴打印方法涂覆，其中喷嘴N相对于掩模M的开口31中的涂覆区域R1朝向框架32的斜面33和斜面 从而能够抑制在涂布区域R1和非涂覆区域R2的边界处液体L的弯液面的产生，并且成膜的缺陷 载流子传输层减少。

公开(公告)号：JP2010205462A

公开(公告)日：2010-09-16

申请号：JP2009047503

申请日：2009-03-02

Applicant: Casio Computer Co Ltd ,  カシオ計算機株式会社

Inventor： KIZU TAKASHI ,  KUMAGAI MINORU

IPC: H05B33/22 ,  H01L51/50 ,  H05B33/10 ,  H05B33/12

Abstract: PROBLEM TO BE SOLVED: To provide a display device having a panel structure and a method of manufacturing the same, capable of restraining generation of a light non-emitting area, in a display picture element having an organic EL element.
SOLUTION: A partition wall layer 17 arranged between picture element forming areas Rpx of respective display picture elements PIX, is formed by patterning a resin layer composed of a non-photosensitive resin material (for example, a resin material including a fluorine compound) by using a dry etching method, and a hole injection layer 15a for constituting an organic EL layer 15 arranged in the picture element forming area Rpx defined by the partition wall layer 17, is also formed by forming a film of oxide (for example, molybdenum oxide) of transition metal by using a vacuum deposition method or a sputtering method.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种具有面板结构的显示装置及其制造方法，能够在具有有机EL元件的显示图像元素中抑制不发光区域的产生。 解决方案：通过对由非感光性树脂材料构成的树脂层（例如，包含氟化合物的树脂材料）构成，形成布置在各显示图像元素PIX的像素形成区域Rpx之间的分隔壁层17 ），并且还通过形成氧化物膜（例如，氧化物膜）形成用于构成布置在由分隔壁层17限定的像素形成区域Rpx中的有机EL层15的空穴注入层15a， 氧化钼），使用真空蒸镀法或溅射法。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2002316419A

公开(公告)日：2002-10-29

申请号：JP2001121889

申请日：2001-04-20

Applicant: CASIO COMPUTER CO LTD

Inventor： KUMAGAI MINORU

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To provide an ink jet print head wherein heat is efficiently radiated even when the ink jet print head is formed on a glass substrate. SOLUTION: A metallic film 16 is formed on the upper face of the glass substrate 15 and a metallic film 17 is formed on the lower face of the glass substrate 15, an insulation film 25, a heating resistor film 26, a heating resistor 26a, an individual wiring electrode 27, a common electrode 28, a partition wall 29 and an orifice plate 31 having an ink ejection nozzle 32 are sequentially laminated on the metallic film 16 on the upper face, and an ink supply groove 33 and an ink supply hole 34 are provided on the glass substrate 15, thereby forming a head section. A through-hole 23 is provided on the glass substrate 15 and a metallic film 24 is formed on the inner wall thereof so that the metallic film 16 and the metallic film 17 on both faces of the substrate 15 are thermally connected with each other by the metallic film 24. The whole ink jet print head 35 is die-bonded to a radiating plate 37 by a die-bonding agent 36. The heat generated on a printing section at the upper face is transferred to the metallic films 16, 24, 17 so that the heat is efficiently radiated to the external section through the radiating plate 37.

公开(公告)号：JP2002067328A

公开(公告)日：2002-03-05

申请号：JP2000256691

申请日：2000-08-28

Applicant: CASIO COMPUTER CO LTD

Inventor： KUMAGAI MINORU

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To provide a recording head which makes it easy to perform installation operation of a driving circuit on a rear surface of a substrate and is also suitable for development of miniaturization of a long recording head. SOLUTION: On a surface of a head substrate 32, a printing part 39 consisting of an ink supply channel 31, a heating element 33, a common electrode 34, an individual wiring electrode 35, a partition wall 36, a top plate 37 and a discharge nozzle 38 is provided. First - third extended parts 35-1, 35-2, and 35-3 of the wiring electrode creeping in from a narrow free space on a right of the printing part 39 on the head substrate 32 to a side end surface and a bottom face are adhered directly on the substrate by patterning. A connecting terminal part of the third extended part 35-3 and a driving circuit 41 arranged beforehand on the back face of the head substrate 32 and bonded with a wire 42, and a wire-bonded part is coated with a protective plastic 43. Wiring and installing is made reasonably and excellent in reliability. Mounting operation of an ink-jet head is performed easily.

公开(公告)号：JP2001270121A

公开(公告)日：2001-10-02

申请号：JP2000086008

申请日：2000-03-27

Applicant: CASIO COMPUTER CO LTD

Inventor： KUMAGAI MINORU

IPC: B41J2/05 ,  B41J2/16

Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable ink-jet printer head capable of always obtaining a normal ejection performance stably without choking of an ink channel caused by dropped fragments of a channel wall due to growth of a processing flaw thereof, and a production method therefor. SOLUTION: By forming a heat generating resistor film 16, an adhesion layer 17 and an electrode film 18 on an insulating substrate 15, and patterning the same, a heat generating part 16a, a common wiring electrode 19 and an individual wiring electrode 21 are formed. Then, an ink supply groove 22 is formed in the insulating substrate 15, A first partition wall 23 is formed, and further a second partition wall is further laminated. An ink supply hole 28 is formed therethrough. Finally, an orifice plate 29 is laminated so as to provide an ejection nozzle 26. The first partition wall 23 covers the wall surface 22a of the ink supply groove 22 and the substrate surface 15-1 in the vicinity of the opening so as to function as a protection film for preventing a problem of growth of generated chipping or cracking of the part due to erosion by an ink and collapse thereof so as to be fine fragments dispersed in the ink groove disturbing a normal ink flow.

公开(公告)号：JP2000343712A

公开(公告)日：2000-12-12

申请号：JP16218699

申请日：1999-06-09

Applicant: CASIO COMPUTER CO LTD

Inventor： UENISHI KATSUZO ,  KANEMITSU SATOSHI ,  KUMAGAI MINORU

IPC: B41J2/16 ,  B41J2/05

Abstract: PROBLEM TO BE SOLVED: To provide a method for processing a chip substrate by which a solder ball for bump connection is easily set. SOLUTION: A partition wall, and interval maintaining member 26, or the like are laminated on a connection part 27 such as an LSI, an electronic circuit, or the like formed on a chip substrate 25. At the time of patterning, a hole 26-1 having a diameter smaller than that of a solder ball 32 is formed at the connection part 27. Furthermore, in laminating, for example, and orifice plate 17, or the like thereon for etching a nozzle, a hole larger than the hole 26-1 of a small diameter, that is, a hole of a substantially same diameter as that of the solder ball 32, is formed thereat as a terminal contact hole 24. By inserting the end part of the chip substrate 25 with the terminal contact holes 24 formed, into the solder balls 32 stored in a container 31 by a large number and pulling it out, the solder balls 32 are set in the terminal contact holes 24. By heat press bonding of a parent substrate with a wiring formed, for example, a flexible printed wiring substrate (FPC) thereon, terminals of the chip substrate and the parent substrate are connected.

公开(公告)号：JPH08201837A

公开(公告)日：1996-08-09

申请号：JP3026395

申请日：1995-01-27

Applicant: CASIO COMPUTER CO LTD

Inventor： KUMAGAI MINORU

IPC: G02F1/1345 ,  H05K3/32 ,  H05K3/36

Abstract: PURPOSE: To improve the reliability of conductive connection between connecting electrodes opposed each other for both base substrates (film substrates). CONSTITUTION: Close material 15 is formed by mixing conductive particles 15b into thermosetting adhesive 15a with the setting and shrinkage factor being greater than that of thermosetting adhesive as material for seal material 5. When the seal material 5 and the thermosetting adhesive 15a for the close material 15 are both thermally set, the thermosetting adhesive 15a for the close material 15 is shrunk greater than the seal material 5. Then, a space between both base substrates 1, 11 in an area where the close material 15 exists in shrunk greater than a space between both base substrates 1, 11 in an area where the seal material 5 exists. As a result, the conductive particles 15b are bitten into connecting electrodes 3, 13 for both base substrates 1, 11 and into both base substrates 1, 11 and put in sure contact with the connecting electrodes 3, 13 for both base substrates 1, 11.

公开(公告)号：JPH0661626A

公开(公告)日：1994-03-04

申请号：JP23261092

申请日：1992-08-10

Applicant: CASIO COMPUTER CO LTD

Inventor： KUMAGAI MINORU

IPC: B32B15/08 ,  H05K3/00 ,  H05K3/28

Abstract: PURPOSE:To produce a film wiring board having openings, e.g. device holes or through holes, in which dimensional accuracy of the opening is enhanced and the strength at the edge of the opening is also enhanced. CONSTITUTION:An aluminum layer 12 is formed on the top face of a copper foil 11, a photoresist 13 is formed thereon, and the aluminum layer 12 is dry etched with the photoresist 12 as a mask. Upon subsequent exfoliation of the photoresist 13, an aluminum protrusion 14 having substantially vertical outer wall is obtained. A polyimide layer 15 is then formed through casting entirely on the top face of copper foil 11 including the aluminum protrusion 14. The polyimide layer 15 is then wet etched until at least the top face of the aluminum protrusion 14 is exposed. Upon removal of the aluminum protrusion 14 through etching, an opening 16 having substantially vertical inner wall is formed in the polyimide layer 15.

公开(公告)号：JP2011048915A

公开(公告)日：2011-03-10

申请号：JP2009193957

申请日：2009-08-25

Applicant: Casio Computer Co Ltd ,  カシオ計算機株式会社

Inventor： KUMAGAI MINORU

IPC: H05B33/10 ,  H01L51/50 ,  H05B33/12 ,  H05B33/22

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing device of a luminescent panel and a manufacturing method of the same, capable of mass-producing the luminescent panels excellent in light emission characteristics with high manufacturing efficiency, and to provide an electronic apparatus having the luminescent panel which is suppressed in the variations of emission luminance.
SOLUTION: A nozzle coat film-deposition device 100, constituting the manufacturing device of luminescent panels, applies ink into a slit 21a in each column of an application mask 21, by scanning a nozzle head 111 in an X-direction with the application mask 21 adhered to a surface of a substrate 11 at the step of applying the ink onto the surface of the substrate 11. Then, the device heat-treats the substrate 11, which is in a state where an organic solution 14x is applied to and filled in the slits 21a, in all columns under reduced pressure, to uniformly and totally dry it to film-deposit an organic EL layer 14, on a pixel electrode 12 exposed to an EL element formation region Re1 of each pixel PIX.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题为了提供一种发光面板的制造装置及其制造方法，能够以高制造效率批量生产发光特性优异的发光面板，并且提供具有 抑制发光亮度变化的发光板。 ＆lt; P＆gt;解决方案：构成发光板制造装置的喷嘴涂膜成膜装置100通过沿着X方向扫描喷嘴头111而将油墨施加到涂布面罩21的各列中的狭缝21a中 在将基板11的表面上施加墨水的步骤的同时，将基板11的表面粘贴在基板11的表面上。然后，对基板11进行热处理，该基板11处于施加有机溶液14x的状态 并在减压下在所有列中填充狭缝21a，以均匀且完全干燥以在暴露于每个像素PIX的EL元件形成区域Re1的像素电极12上沉积有机EL层14。 版权所有（C）2011，JPO＆INPIT