公开(公告)号：US20240074127A1

公开(公告)日：2024-02-29

申请号：US18221461

申请日：2023-07-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chen-Yu Wang ,  Pai-Sheng Cheng ,  Huan-Kuen Chen

IPC: H05K9/00 ,  H05K1/05 ,  H05K1/18

CPC classification number: H05K9/0037 ,  H05K1/05 ,  H05K1/181 ,  H05K9/0088 ,  H05K2201/0104 ,  H05K2201/10977

Abstract: In a method of manufacturing an electronic package, first grooves are formed on a circuit structure and a second groove is formed in each of the first grooves to allow the circuit structure to become circuit layers. Owing to the second groove is narrower than the first groove, each of the circuit layers has an encircled surface and a notch located on the encircled surface. When a shielding layer is provided to cover an encapsulating body located on the circuit layer, a space of the notch is not covered by the shielding layer such that a portion to be removed of the shielding layer will not remain on the electronic package to become burr after removing the portion to be removed.