公开(公告)号：US20150198659A1

公开(公告)日：2015-07-16

申请号：US14669783

申请日：2015-03-26

Applicant: CHROMA ATE INC.

Inventor： XIN-YI WU ,  JUI-CHE CHOU ,  MENG-KUNG LU ,  CHIN-YI OU YANG

IPC: G01R31/28 ,  H05K7/20

CPC classification number: G01R31/2877 ,  G01R31/2874 ,  H05K7/20136 ,  H05K7/20254

Abstract: A radiator module system for automatic test equipment, including a test arm and a closed-loop circulating cooling device disposed on the test arm. The test arm includes a test head, and an internal channel is formed within and passing through the test head. The closed-loop circulating cooling device includes an inlet and an outlet, respectively connected to the internal channel; a conduit connecting the inlet and the outlet, such that the conduit and the internal channel form a closed-loop circulating channel in which a working fluid flows; a cooling device in contact with the conduit, configured to perform heat dissipation to the working fluid flowing within the conduit; and a driving source configured to drive the working fluid to flow within the closed-loop circulating channel. The working fluid is driven by the driving source to flow within the closed-loop circulating channel to perform heat dissipation.

Abstract translation: 一种用于自动测试设备的散热器模块系统，包括设置在测试臂上的测试臂和闭环循环冷却装置。 测试臂包括测试头，内部通道形成在测试头内并通过测试头。 闭环循环冷却装置包括分别连接到内部通道的入口和出口; 连接入口和出口的管道，使得管道和内部通道形成工作流体流动的闭环循环通道; 与导管接触的冷却装置，被配置为对在管道内流动的工作流体进行散热; 以及构造成驱动工作流体在闭环循环通道内流动的驱动源。 工作流体由驱动源驱动，在闭环循环通道内流动以进行散热。

公开(公告)号：MY170414A

公开(公告)日：2019-07-29

申请号：MYPI2013700711

申请日：2013-05-02

Applicant: CHROMA ATE INC

Inventor： CHIEN-MING CHEN ,  MENG-KUNG LU

Abstract: A test device is provided for testing a bottom chip ( 5) of a package-on-package (PoP) stacked-chip. An upper surface (51) of the bottom chip (5) has a plurality of soldering points (511) for electrically connecting a plurality of corresponding soldering points (222) of a top chip (221) of the PoP stacked-chip. The test device includes a test head (22) and a plurality of test contacts (224). The test head (22) has the top chip (221) installed inside. The plurality of test contacts (224)is installed on a lower surface (225) of the test head (22) and electrically connected to the plurality of corresponding soldering points (222) of the top chip (221)inside the test head (22). When the lower surface (225) of the test head (22) contacts the upper surface (51) of the bottom chip (5), the plurality of test contacts (224)is electrically connected to the plurality of soldering points (511) for testing the bottom chip (5). Figure 4

公开(公告)号：SG194333A1

公开(公告)日：2013-11-29

申请号：SG2013033956

申请日：2013-05-02

Applicant: CHROMA ATE INC

Inventor： CHIEN-MING CHEN ,  MENG-KUNG LU

Abstract: A test device is provided for testing a bottom chip of a package-on package (PoP) stacked-chip. An upper surface of the bottom chip has a plurality of soldering points for electrically connecting a plurality of corresponding soldering points of a top chip of the PoP stacked-chip. The test device includes a test head and a plurality of test contacts. The test head has the top chip installed inside. The plurality of test contacts isinstalled on a lower surface of the test head and electrically connected to the plurality of corresponding soldering points of the top chip inside the test head. When the lower surface of the test head contacts the upper surface of the bottom chip, the plurality of test contacts is electrically connected to the plurality of soldering points for testing the bottom chip.