公开(公告)号：JP2013024860A

公开(公告)日：2013-02-04

申请号：JP2011267167

申请日：2011-12-06

Applicant: Chroma Ate Inc ,  クロマ エーティーイー インコーポレイテッドChroma Ate Inc.

Inventor： TSENG I-SHIH ,  CHANG TIEN-TENG ,  REH JEFF ,  CHENG CHIH-YU ,  CHENG HSU-TING

IPC: G01R31/26 ,  G01J1/00 ,  H01L33/00

CPC classification number: G01R31/2635 ,  G01R1/0408

Abstract: PROBLEM TO BE SOLVED: To measure a flip-chip LED without causing deformation due to negative pressure during fixing.SOLUTION: A test device 3 for a flip-chip LED includes a transparent substrate 30, a spacer member 32, a soft and transparent support stage 34, and a vacuum generator 36. The spacer member 32 is formed on a first surface 300 of the transparent substrate 30. The soft and transparent support stage 34 for substrate is detachably fitted into the spacer member 32 so as to form a closed space S1 by the soft and transparent support stage 34, the spacer member 32, and the first surface 300 of the transparent substrate 30. The vacuum generator 36 is connected to the closed space S1 to suck out air from the closed space S1, and a part of the soft and transparent support stage 34 is stuck to the first surface 300 to form a test area 340 in which a flip-chip LED is set.

Abstract translation: 要解决的问题：测量倒装芯片LED，而不会由于固定期间的负压而引起变形。 解决方案：用于倒装芯片LED的测试装置3包括透明基板30，间隔件32，柔软透明的支撑台34和真空发生器36.间隔件32形成在第一表面 300的透明基板30.用于基板的柔软和透明的支撑台34可拆卸地装配到间隔件32中，以便通过软和透明支撑台34，间隔件32和第一表面形成封闭空间S1 300.透明基板30的真空发生器36连接到封闭空间S1以从封闭空间S1吸出空气，并且将柔软和透明的支撑台34的一部分粘附到第一表面300以形成测试 区域340，其中设置倒装芯片LED。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2012225901A

公开(公告)日：2012-11-15

申请号：JP2012028675

申请日：2012-02-13

Applicant: Chroma Ate Inc ,  クロマ エーティーイー インコーポレイティッド.

Inventor： CHENG HSU-TING ,  TSENG I-SHIH ,  WANG TSUN-I

IPC: G01J3/46 ,  G01M11/00

CPC classification number: G01J3/51 ,  G01J2001/4252 ,  G01J2005/608 ,  G01R31/2635

Abstract: PROBLEM TO BE SOLVED: To provide a light emitting component measuring system and a method thereof, capable of measuring the optical proprieties of a plurality of devices under test (DUT).SOLUTION: Each DUT 2 is capable of receiving electricity so as to output an initial ray, in which each initial ray has a first wavelength range. A light emitting component measuring system 1 comprises a filtering device 14 and a sensing device 16. The filtering device 14 comprises a first filtering portion 142 which can filter a corresponding third wavelength of the initial rays and output a plurality of first filtered rays 24 simultaneously. Each first filtered ray 24 has a second wavelength range respectively. The sensing device 16 receives the ray outputted from the filtering device 14 and generates optical data accordingly.

Abstract translation: 要解决的问题：提供一种能够测量被测设备（DUT）的光学特性的发光元件测量系统及其方法。 解决方案：每个DUT 2能够接收电力以输出初始射线，其中每个初始射线具有第一波长范围。 发光元件测量系统1包括过滤装置14和感测装置16.过滤装置14包括第一过滤部分142，该第一过滤部分142可以过滤相应的初始光线的第三波长并同时输出多个第一滤波光线24。 每个第一滤波光线24分别具有第二波长范围。 感测装置16接收从过滤装置14输出的射线，并相应地产生光学数据。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：WO2008057519A3

公开(公告)日：2008-10-02

申请号：PCT/US2007023337

申请日：2007-11-01

Applicant: CHROMA ATE INC

Inventor： TSENG I-SHIH

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It s a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?u m d)/µ=2,500; with ? being the fluid density, u m being the free- stream fluid velocity, d being the pipe distance or diameter, µ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation: 它是一种顶部安装表面气流散热器，利用由气隙隔开的上部顶壁，与加热装置（微处理器）的上表面一起产生气流。 这是一种简单的设备，使用雷诺方程Re =（？u m D d）/μ= 2,500，成本低廉; 与？ 作为流体密度，u> m是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，导致空气中频繁的热交换。 它也会导致不同层次空气中明显的温度变化。 因此，它大大增加了散热的效率。 它只需要空气的输入。 操作简单，可以使用更高的发热装置。 因此，它可以在电路板组件的安装中促进该顶部安装散热装置的替代使用。

公开(公告)号：WO2008057518A2

公开(公告)日：2008-05-15

申请号：PCT/US2007023336

申请日：2007-11-01

Applicant: CHROMA ATE INC

Inventor： TSENG I-SHIH

IPC: H05K7/20

CPC classification number: H01L23/467 ,  G06F1/20 ,  H01L2924/0002 ,  H01L2924/00

Abstract: It's a type of top mount surface airflow heatsink, utilizing the upper ceiling wall separated by an air gap, working together with the upper surface of a heating device (microprocessor) producing an air current. It's a simple device, with a low cost using the Reynolds Equation Re=(?u m d)/µ=2,500; with p being the fluid density, u m being the free-stream fluid velocity, d being the pipe distance or diameter, µ being the fluid viscosity. Since the airflow produces air turbulence, it causes the frequent heat exchanges in the air. It also causes the obvious temperature changes within the different layers of air. Therefore, it increases tremendously, the efficiency of dissipating the heat. It requires only the input of the air. The operation is simple and it allows the usage of even higher heat generating devices. Thus it promotes the alternative usage of this top mount heatsink device within the installation of circuit board components.

Abstract translation: 它是一种顶部安装表面气流散热器，利用由气隙隔开的上部顶壁，与加热装置（微处理器）的上表面一起产生气流。 这是一种简单的设备，使用雷诺方程Re =（？u m D d）/μ= 2,500，成本低廉; 其中p是流体密度，u是自由流体流速，d是管道距离或直径，μ是流体粘度。 由于气流产生空气湍流，导致空气中频繁的热交换。 它也会导致不同层次空气中明显的温度变化。 因此，它大大增加了散热的效率。 它只需要空气的输入。 操作简单，可以使用更高的发热装置。 因此，它可以在电路板组件的安装中促进该顶部安装散热装置的替代使用。