公开(公告)号：US10149384B1

公开(公告)日：2018-12-04

申请号：US16027288

申请日：2018-07-04

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Yung-Tai Su ,  Ching-Fang Cheng ,  Ti-Chiang Chiu

IPC: H05K1/09 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/30 ,  H05K3/22

Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.

公开(公告)号：US20180332704A1

公开(公告)日：2018-11-15

申请号：US16027288

申请日：2018-07-04

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Yung-Tai SU ,  Ching-Fang Cheng ,  Ti-Chiang Chiu

IPC: H05K1/11 ,  H05K3/30 ,  H05K3/22 ,  H05K3/40 ,  H05K3/34 ,  H05K1/09

CPC classification number: H05K1/111 ,  H05K1/09 ,  H05K1/115 ,  H05K3/225 ,  H05K3/301 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0364 ,  H05K2201/10734 ,  H05K2203/167

Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.

公开(公告)号：US10021783B2

公开(公告)日：2018-07-10

申请号：US15435320

申请日：2017-02-17

Applicant: CHUNGHWA PRECISION TEST TECH. CO., LTD.

Inventor： Yung-Tai Su ,  Ching-Fang Cheng ,  Ti-Chiang Chiu

IPC: H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K1/111 ,  H05K1/09 ,  H05K1/115 ,  H05K3/225 ,  H05K3/301 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4038 ,  H05K2201/0364 ,  H05K2201/10734 ,  H05K2203/167

Abstract: A support structure located at a bottom of a ball grid array (BGA) is provided. The support structure includes a printed circuit board (PCB) having first positioning pin holes, an interface plate having second positioning pin holes which correspond to the first positioning pin holes arranged on the PCB, a support film arranged on the PCB and having support portions, and positioning components penetrating the first positioning pin holes and the second positioning pin holes corresponding to the first positioning pin holes to assemble the support film on the PCB and the interface plate.