POSITIVE PHOTORESIST
    2.
    发明专利

    公开(公告)号:JPH0850356A

    公开(公告)日:1996-02-20

    申请号:JP17955495

    申请日:1995-06-22

    Applicant: CIBA GEIGY AG

    Abstract: PURPOSE: To provide a positive type photoresist material which has a long-term preservation life without requiring a thermal post treatment, affords a relief structure of good resolution and has high photosensitivity. CONSTITUTION: This positive type photoresist compsn. consists of at least one kind of hompolymers or copolymers contg. acid active (acidlabile) α-alkoxyalkyl ester group, at least one kind of carboxyl-contg. copolymers having 0.40 to 5.50mol/kg content of carboxyl groups, at least one kind of compds. forming an acid in exposure to chemical rays and is developable with an aq. alkaline medium consisting of an org. solvent. This process for production of the relief structure uses such photoresist compsn.

    CURING AGENT FOR EPOXY RESIN
    3.
    发明专利

    公开(公告)号:JPH1067819A

    公开(公告)日:1998-03-10

    申请号:JP19189797

    申请日:1997-07-02

    Applicant: CIBA GEIGY AG

    Abstract: PROBLEM TO BE SOLVED: To obtain a reaction product for a latent epoxy curing agent, having a higher stability against mechanical stress and an improved pot life by using a reaction product of a microgel having specified groups with a nitrogenous base. SOLUTION: This is a reaction product of a microgel containing carboxylic groups with a nitrogenous base. It is desirably one in which the microgel is a copolymer of at least one unsaturated carboxylic acid with at least one polyfunctional crosslinking agent. It is more desirably one in which the microgel is a copolymer of at least one unsaturated carboxylic acid with at least one carboxyl-free vinyl monomer and at least one polyfunctional crosslinking agent.

    COMPOSITION CONTAINING CYCLIC ACETAL OR CYCLIC KETAL OF BETA-KETO ESTER OR BETA-AMIDE

    公开(公告)号:JPH0822127A

    公开(公告)日:1996-01-23

    申请号:JP19240995

    申请日:1995-07-05

    Applicant: CIBA GEIGY AG

    Inventor: ROTH MARTIN

    Abstract: PROBLEM TO BE SOLVED: To provide a compsn. with which the formation of photosensitive layers of a wide range of thicknesses is possible and is adequately usable as a positive type photoresist for printing plates, printed circuits, integrated circuits, non-silver photographic films, etc. SOLUTION: This compsn. consists of (a) the compd. of the formula and (b) compds. (halogen compds., positive ion photoinitiators, etc.) which liberate an acid by exposure to chemical rays. The compsn. contains (a), (b) and (c) a binder (novolak, etc.). (an example of groups, R =methyl, phenyl, R to R =H, X=-O-, -NH-, m=2, 3, n=0, 1, Q = an aliphat. group, alicyclic group, arom. aliphat. group of (m) value).

    EPOXY ACRYLATES
    5.
    发明专利

    公开(公告)号:CA2127232C

    公开(公告)日:2006-11-21

    申请号:CA2127232

    申请日:1994-06-30

    Applicant: CIBA GEIGY AG

    Abstract: Novel epoxy acrylates and carboxyl group- containing epoxy acrylates of formulae II SEE FORMULA I wherein M is the group of formula SEE FORMULA II R1 is -H or -CH3, R2-H, -CH3 or phenyl, R is -H, C1-C4 alkyl or halogen, x is an integer from 0 to 3, and Y is a linking group of formula SEE FORMULA III wherein R3 and R4 are each independently of the other hydrogen or C1-C4alkyl, or R3 and R4, together with the linking carbon atom, form a 5- or 6-membered hydrocarbon ring, and the aromatic radicals of the linking group Y are unsubstituted or substituted by halogen or C1-C4alkyl, X is -S-, -O-, or -SO2-, and n is an integer from 0 to 300, with the proviso that at least 10 mol % of the radicals M have the structure of formula in which R1 and R2 are as defined above and III wherein A is hydrogen or the group of formula and R1, R2, R, n and x are as defined above, R5 is the radical of a cyclic anhydride of a polycarboxylic acid after removal of the anhydride radical, and at least 10 mol% of the radicals A have the structure of the formula and Y is a linking group of the formula or wherein R3 and R4 are independently of one another hydrogen or C1-C4alkyl or R3 and R4, together with the linking carbon atom, form a 5-or 6-membered hydrocarbon ring, and the aromatic radicals of the linking group Y are unsubstituted or substituted by halogen or C1-C4-alkyl, and X is -S-, -O- or -SO2- of the claims that are relatively high molecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

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