公开(公告)号：WO2021061560A1

公开(公告)日：2021-04-01

申请号：PCT/US2020/051767

申请日：2020-09-21

Applicant: CISCO TECHNOLOGY, INC.

Inventor： RAZDAN, Sandeep ,  PATEL, Vipulkumar K. ,  PRASAD, Aparna R.

IPC: G02B6/42

Abstract: Photonic devices include a photonic assembly and a substrate coupled to the photonic assembly. The photonic assembly includes a photonic die and an optical device coupled to the photonic die with an adhesive to form an optical connection between the optical device and the photonic die. The photonic assembly is coupled to the photonic assembly by reflowing a plurality of solder connections at temperature that is less than a cure temperature of the adhesive.

公开(公告)号：WO2023028418A1

公开(公告)日：2023-03-02

申请号：PCT/US2022/074740

申请日：2022-08-10

Applicant: CISCO TECHNOLOGY, INC.

Inventor： PATEL, Vipulkumar K. ,  TRAVERSO, Matthew J. ,  RAZDAN, Sandeep ,  PRASAD, Aparna R.

IPC: G02B6/42 ,  H01L25/16

Abstract: Embodiments herein describe an optical system that includes a photonic integrated circuit (PIC) bonded to a package containing an electrical integrated circuit (EIC). However, this bond can prevent an edge coupler from optically aligning an optical fiber to an edge of the PIC in order to transfer optical signals. To provide room for the edge coupler, the PIC is arranged to overhang the package containing the EIC so that the package does not interfere with the ability of the edge coupler to align with the side or edge of the PIC. In this manner, an optical fiber can be optically aligned (e.g., butt coupled) to the edge of the PIC rather than having to use a grating coupler or some other less efficient optical coupling in order to transfer optical signals between the PIC and the optical fiber.

公开(公告)号：WO2020198358A1

公开(公告)日：2020-10-01

申请号：PCT/US2020/024716

申请日：2020-03-25

Applicant: CISCO TECHNOLOGY, INC.

Inventor： SIRIANI, Dominic F. ,  PATEL, Vipulkumar K.

IPC: H01S5/026 ,  H01S5/20 ,  H01S5/22 ,  H01S5/022 ,  H01S5/028 ,  H01S5/10 ,  H01S5/12

Abstract: A master oscillator power amplifier comprises a semiconductor laser formed on a substrate and configured to output an optical signal, and a semiconductor optical amplifier (SOA) formed on the substrate. The SOA comprises an optical waveguide having an optically active region, wherein the optical waveguide is configured to expand a mode size of the optical signal along at least two dimensions.

公开(公告)号：EP3949043A1

公开(公告)日：2022-02-09

申请号：EP20720249.0

申请日：2020-03-25

Applicant: Cisco Technology, Inc.

Inventor： SIRIANI, Dominic F. ,  PATEL, Vipulkumar K.

IPC: H01S5/026 ,  H01S5/20 ,  H01S5/22 ,  H01S5/022 ,  H01S5/028 ,  H01S5/10 ,  H01S5/12

公开(公告)号：EP4392817A1

公开(公告)日：2024-07-03

申请号：EP22772747.6

申请日：2022-08-10

Applicant: Cisco Technology, Inc.

Inventor： PATEL, Vipulkumar K. ,  TRAVERSO, Matthew J. ,  RAZDAN, Sandeep ,  PRASAD, Aparna R.

IPC: G02B6/42 ,  H01L25/16

CPC classification number: G02B6/4246 ,  G02B6/4269 ,  G02B6/428 ,  H01L25/167 ,  G02B6/424 ,  G02B6/4249 ,  G02B6/4202

公开(公告)号：EP3953753A1

公开(公告)日：2022-02-16

申请号：EP20723608.4

申请日：2020-04-01

Applicant: Cisco Technology, Inc.

Inventor： PATEL, Vipulkumar K. ,  PRASAD, Aparna R. ,  RAZDAN, Sandeep

IPC: G02B6/42 ,  H01L23/04

公开(公告)号：EP4034927A1

公开(公告)日：2022-08-03

申请号：EP20786647.6

申请日：2020-09-21

Applicant: Cisco Technology, Inc.

Inventor： RAZDAN, Sandeep ,  PATEL, Vipulkumar K. ,  PRASAD, Aparna R.

IPC: G02B6/42