Treatment of pain with gap junction modulation compounds

    公开(公告)号:AU2016216611A1

    公开(公告)日:2016-09-01

    申请号:AU2016216611

    申请日:2016-08-17

    Abstract: TREATMENT OF PAIN WITH GAP JUNCTION MODULATION The present invention relates to delivery, including transdermal delivery, of a therapeutically effective amount of a compound useful for modulating gap junction formation and function, including an oligonucleotide for reducing gap junction formation and function, and methods and compositions for treating a subject suffering from pain associated with a disease, disorder or condition and associated with pain, including but not limited to muscle pain, ligament pain, tendon pain, joint pain and post-operative pain.

    TREATMENT OF PAIN WITH GAP JUNCTION MODULATION COMPOUNDS

    公开(公告)号:CA2727015A1

    公开(公告)日:2009-12-10

    申请号:CA2727015

    申请日:2009-06-04

    Abstract: The present invention relates to delivery, including transdermal delivery, of a therapeutically effective amount of a compound useful for modulating gap junction formation and function, including an oligonucleotide for reducing gap junction formation and function, and methods and compositions for treating a subject suffering from pain associated with a disease, disorder or condition and associated with pain, including but not limited to muscle pain, ligament pain, tendon pain, joint pain and post-operative pain.

    Treatment of pain with gap junction modulation compounds

    公开(公告)号:AU2009255619A1

    公开(公告)日:2009-12-10

    申请号:AU2009255619

    申请日:2009-06-04

    Abstract: The present invention relates to delivery, including transdermal delivery, of a therapeutically effective amount of a compound useful for modulating gap junction formation and function, including an oligonucleotide for reducing gap junction formation and function, and methods and compositions for treating a subject suffering from pain associated with a disease, disorder or condition and associated with pain, including but not limited to muscle pain, ligament pain, tendon pain, joint pain and post-operative pain.

    TREATMENT OF PAIN WITH GAP JUNCTION MODULATION COMPOUNDS

    公开(公告)号:ZA201100046B

    公开(公告)日:2011-10-26

    申请号:ZA201100046

    申请日:2011-01-03

    Abstract: The present invention relates to delivery, including transdermal delivery, of a therapeutically effective amount of a compound useful for modulating gap junction formation and function, including an oligonucleotide for reducing gap junction formation and function, and methods and compositions for treating a subject suffering from pain associated with a disease, disorder or condition and associated with pain, including but not limited to muscle pain, ligament pain, tendon pain, joint pain and post-operative pain.

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