公开(公告)号：US20240235000A1

公开(公告)日：2024-07-11

申请号：US18560896

申请日：2022-05-13

Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

Inventor： Andrew SQUIRES ,  Jia DU ,  Timothy Anthony VAN DER LAAN

IPC: H01P7/06 ,  H01P7/10 ,  H01P11/00 ,  H01Q15/14 ,  H03J3/16

CPC classification number: H01P7/065 ,  H01P7/10 ,  H01P11/008 ,  H01Q15/14 ,  H03J3/16

Abstract: This disclosure relates to chips, and methods for manufacturing devices, that interact with electromagnetic radiation. A method for manufacturing a device comprises disposing an unpatterned graphene layer on a substrate, which comprises an unpatterned metal layer to form an unpatterned graphene-metal bi-layer attached to a surface of the substrate. The method then comprises patterning the bi-layer through the graphene layer and the metal layer with a design that comprises one or more superimposed trenches. Each of the one or more trenches extend through the graphene layer and the metal layer to provide interaction with electromagnetic radiation.