公开(公告)号：US12168199B2

公开(公告)日：2024-12-17

申请号：US17856534

申请日：2022-07-01

Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION

Inventor： Matthew Langley ,  David Viano ,  Michael Dolan

IPC: B01D53/22 ,  B01D67/00 ,  B01D69/04 ,  B01D71/02 ,  C25D3/56 ,  C25D5/34 ,  C25D7/04

Abstract: A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold complex, wherein the ratio of gold to palladium to in the solution is from 5 to 40 w/w %. Also taught is a substrate such as a vanadium or vanadium alloy gas separation membrane coated with a palladium-gold alloy layer.