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公开(公告)号:HRP20211232T1
公开(公告)日:2021-12-10
申请号:HRP20211232
申请日:2021-07-30
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO , BENEDETTO ADRIAN , STRUCK DETLEV
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公开(公告)号:PL3063948T3
公开(公告)日:2018-05-30
申请号:PL14790565
申请日:2014-10-24
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO
IPC: H04Q1/14
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公开(公告)号:PL3087641T3
公开(公告)日:2021-09-13
申请号:PL14808998
申请日:2014-12-05
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO
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公开(公告)号:PL2757802T3
公开(公告)日:2018-08-31
申请号:PL14151891
申请日:2014-01-21
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO , WIEDITZ WERNER
IPC: H04Q1/06
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公开(公告)号:PL2847828T3
公开(公告)日:2021-11-15
申请号:PL13708849
申请日:2013-03-13
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO , BENEDETTO ADRIAN , STRUCK DETLEV
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公开(公告)号:PL3084892T3
公开(公告)日:2020-08-10
申请号:PL14809829
申请日:2014-12-05
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO
IPC: H01R9/26 , H01R13/627 , H01R13/6583 , H04Q1/14
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公开(公告)号:PL2719032T3
公开(公告)日:2018-08-31
申请号:PL12726134
申请日:2012-06-08
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO , BUSSE RALF-DIETER , STARK JOACHIM , MEYER PHILIPP
IPC: H01R43/01
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公开(公告)号:PL2507869T3
公开(公告)日:2018-06-29
申请号:PL10726909
申请日:2010-06-17
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: NEUMETZLER HEIKO
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公开(公告)号:AU2011367429B2
公开(公告)日:2017-06-01
申请号:AU2011367429
申请日:2011-12-02
Applicant: COMMSCOPE TECHNOLOGIES LLC
Inventor: BUSSE RALF-DIETER , NEUMETZLER HEIKO , STARK JOACHIM , MEYER PHILIPP , NIJHUIS ANTONY
Abstract: The invention relates to a distributor connection module (1) for telecommunications and data technology, wherein the distributor connection module (1) comprises a first sub-module (2) and a second sub-module (3), wherein the first and second sub-modules (2, 3) each have contact elements (7, 13), wherein the contact elements (7, 13) each have an electrical connecting contact (8, 14) and an interface contact (9, 15), wherein the interface contacts (9) of the first sub-module (2) are electrically connected together to the interface contacts (15) of the second sub-module (3) or the interface contacts (9) of the first sub-module (2) are connected to interface contacts (61) of a further sub-module (60) and the interface contacts (15) of the second sub-module (3) are connected to interface contacts (62) of a further sub-module (60), wherein the further sub-modules (60) are disposed between the first and second sub-modules (2, 3).
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