公开(公告)号：WO2018009792A1

公开(公告)日：2018-01-11

申请号：PCT/US2017/041095

申请日：2017-07-07

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： JAYAWARDENA, Adikaramge Asiri ,  SCARLATA, Andrew Francis

IPC: H01L33/48 ,  H01L33/52 ,  H01L33/64

Abstract: A light system includes a first substrate and a second substrate having the first substrate thereon. A light emitting diode (LED) is connected to the first substrate. An encapsulation layer covers the LED and at least a majority of the first substrate.

Abstract translation: 发光系统包括第一基板和其上具有第一基板的第二基板。 发光二极管（LED）连接到第一基板。 封装层覆盖LED和至少大部分第一衬底。