公开(公告)号：WO2014137633A1

公开(公告)日：2014-09-12

申请号：PCT/US2014/017902

申请日：2014-02-24

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： RUSTOMJI, Cyrus Sam ,  KIM, Kyle Yun-Su

IPC: H01G11/74 ,  H01G11/80 ,  H01G11/82

CPC classification number: H01G2/103 ,  H01G9/145 ,  H01G11/74 ,  H01G11/80 ,  H01G11/82 ,  H01M2/046 ,  H01M2/30 ,  H01M2/365 ,  Y02E60/13

Abstract: An electrochemical energy storage device includes a housing (102), at least one energy storage element (103) in the housing (102) and operable with an electrolyte, a cap (104) coupled to the housing (102), at least one electrolyte impregnation hole (130) formed in the cap (104), and a first terminal lug (106) attachable to the cap (104) via the electrolyte impregnation hole (130).

Abstract translation: 电化学能量存储装置包括壳体（102），壳体（102）中的至少一个能量存储元件（103）并且可与电解质一起操作，联接到壳体（102）的盖（104），至少一个电解质 形成在盖（104）中的浸渍孔（130）以及经由电解质浸渍孔（130）可连接到盖（104）的第一端子凸耳（106）。

公开(公告)号：WO2014137591A1

公开(公告)日：2014-09-12

申请号：PCT/US2014/017051

申请日：2014-02-19

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： RUSTOMJI, Cyrus Sam ,  KIM, Kyle Yun-Su

IPC: H01G11/82 ,  H01G2/10 ,  H01M2/22 ,  H01R4/48

CPC classification number: H01G11/74 ,  H01G11/66 ,  H01G11/70 ,  H01G11/82 ,  H01M2/22 ,  H01R4/4881 ,  H01R4/60 ,  Y02E60/13

Abstract: Electrochemical energy storage devices such as electric double layer capacitors include a flexible metal contact current collector establishing electrical contact with a conductive housing at numerous contact points. The flexible current collector simplifies manufacturing of the device and avoids laser welding on the conductive housing. The manufacture devices are operable with a reduced direct current resistance by virtue of the flexible current collector.

Abstract translation: 诸如双电层电容器的电化学能量存储装置包括柔性金属接触集电器，其在许多接触点处与导电外壳建立电接触。 灵活的集电器简化了器件的制造，避免了导电外壳上的激光焊接。 借助于柔性集电器，制造装置可以以降低的直流电阻工作。

公开(公告)号：WO2014133838A1

公开(公告)日：2014-09-04

申请号：PCT/US2014/017039

申请日：2014-02-19

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： KAMATH, Hundi Panduranga ,  KIM, Kyle Yun-Su ,  RUSTOMJI, Cyrus Sam

IPC: H01L23/10

CPC classification number: H05K5/065 ,  H01G2/103 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Moisture barrier packages for electrical components mountable to a circuit board include a cover and a base configured to provide a metal to metal joint that hermitically seals an electrical component in an enclosure defined by the cover and the base. The base may include patterned metallizations using circuit board printing techniques that facilitate connection of the electrical component to the circuit board. The base of the moisture barrier package may be configured for surface mounting of the electrical component or through-hole mounting to complete the electrical connection to the board through the base.

Abstract translation: 用于可安装到电路板的电气部件的防潮包装包括盖和基座，其构造成提供金属对金属接头，该金属接合件密封地密封由盖和基座限定的外壳中的电气部件。 基座可以包括利用电路板打印技术的图案化金属化，这些技术有助于将电气部件连接到电路板。 防潮包装的底部可以被配置为用于电气部件或通孔安装的表面安装，以完成通过基座到板的电连接。

公开(公告)号：WO2012050818A1

公开(公告)日：2012-04-19

申请号：PCT/US2011/053385

申请日：2011-09-27

Applicant: COOPER TECHNOLOGIES COMPANY ,  KIM, Kyle Yun-Su ,  KAMATH, Hundi Panduranga

Inventor： KIM, Kyle Yun-Su ,  KAMATH, Hundi Panduranga

IPC: H01G9/08 ,  H01G9/155 ,  H01G9/10 ,  H01G9/26

CPC classification number: H01G11/12 ,  H01G11/80 ,  Y02E60/13 ,  Y10T29/417

Abstract: Electric double layer capacitor (EDLC) devices include sealing conductor establishing a series connection between multiple storage cells in a single package, which may be operable at higher voltages than conventional EDLC devices.

Abstract translation: 电双层电容器（EDLC）器件包括密封导体，其在单个封装中的多个存储单元之间建立串联连接，其可在比传统EDLC器件更高的电压下工作。

公开(公告)号：EP2628167A1

公开(公告)日：2013-08-21

申请号：EP11764937.6

申请日：2011-09-27

Applicant: Cooper Technologies Company

Inventor： KIM, Kyle Yun-Su ,  KAMATH, Hundi Panduranga

IPC: H01G9/08 ,  H01G9/155 ,  H01G9/10 ,  H01G9/26

CPC classification number: H01G11/12 ,  H01G11/80 ,  Y02E60/13 ,  Y10T29/417

Abstract: Electric double layer capacitor (EDLC) devices include sealing conductor establishing a series connection between multiple storage cells in a single package, which may be operable at higher voltages than conventional EDLC devices.