公开(公告)号：WO2014150934A1

公开(公告)日：2014-09-25

申请号：PCT/US2014/024588

申请日：2014-03-12

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： KRISHNAMOORTHY, Ahila ,  BOGERT, Robert James ,  YAN, Yipeng

IPC: H01F3/10 ,  H01F3/14 ,  H01F17/04 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29 ,  H01F27/30

CPC classification number: H01F27/292 ,  H01F3/10 ,  H01F3/14 ,  H01F17/04 ,  H01F27/255 ,  H01F27/2847 ,  H01F27/306 ,  H01F2003/106 ,  H01F2017/048

Abstract: Magnetic component assemblies for circuit boards include single, shaped magnetic core pieces formed with a physical gap and conductive windings assembled to the cores via the gaps. The physical gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.

Abstract translation: 用于电路板的磁性部件组件包括形成有物理间隙的单个形状的磁芯片，并且经由间隙组装到芯上的导电绕组。 芯中的物理间隙填充有磁性材料以增强磁性能。 磁性部件组件可以限定功率电感器。

公开(公告)号：WO2014150974A1

公开(公告)日：2014-09-25

申请号：PCT/US2014/024689

申请日：2014-03-12

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： KRISHNAMOORTHY, Ahila ,  BOGERT, Robert James ,  YAN, Yipeng

IPC: H01F3/10 ,  H01F3/14 ,  H01F17/04 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29 ,  H01F27/30

CPC classification number: H01F27/292 ,  H01F3/10 ,  H01F3/14 ,  H01F17/04 ,  H01F27/255 ,  H01F27/2847 ,  H01F27/306 ,  H01F2003/106 ,  H01F2017/048

Abstract: Magnetic component assemblies for circuit boards include magnetic cores formed with a gap and preformed conductive windings sliding assembled to the cores via the gaps. The gaps in the cores are filled with a magnetic material to enhance the magnetic performance. The magnetic component assemblies may define power inductors.

Abstract translation: 用于电路板的磁性部件组件包括形成有间隙的磁芯和预先形成的导电绕组，其通过间隙组装到芯上。 芯中的间隙填充有磁性材料以增强磁性能。 磁性部件组件可以限定功率电感器。