公开(公告)号：WO2018026752A1

公开(公告)日：2018-02-08

申请号：PCT/US2017/044794

申请日：2017-08-01

Applicant: COOPER TECHNOLOGIES COMPANY

Inventor： SHAO, Yan ,  GANESAN, Prasath Balamurugan ,  DANDEKAR, Chinmaya R. ,  MAPKAR, Javed Abdurrazzaq

IPC: H01B3/00

CPC classification number: H01B3/47 ,  H01B3/002 ,  H01B3/30 ,  H01B3/305 ,  H01B3/421

Abstract: The disclosed concept pertains to thermoplastic composites, e.g., nano-filler-polymer systems, for use in insulating and/or encapsulating an electrical component to provide electrical insulation, and a protective barrier from environmental conditions. The thermoplastic composites include a polymer, e.g., polymer matrix, micro-size and/or nano-size filler(s) and additive(s). The filler(s) is specifically selected with the intent of imparting improved dielectric properties to the thermoplastic composite, as compared to the polymer absent of the filler. The additive(s) impart environmental resistive properties to the thermoplastic composite.

Abstract translation: 所公开的构思涉及热塑性复合材料，例如纳米填料 - 聚合物系统，其用于绝缘和/或包封电部件以提供电绝缘以及与环境条件相关的保护屏障。 热塑性复合材料包括聚合物，例如聚合物基质，微米尺寸和/或纳米尺寸的填料和添加剂。 与没有填料的聚合物相比，特意选择填料以意图赋予热塑性复合材料改进的介电性能。 添加剂赋予热塑性复合材料环境抵抗性。