公开(公告)号：CA3120662A1

公开(公告)日：2020-05-28

申请号：CA3120662

申请日：2019-10-29

Applicant: CORNING INC

Inventor： ALLINGTON ERIC LEWIS ,  BLACK MATTHEW LEE ,  DEMARTINO STEVEN EDWARD ,  MARKLEY JODY PAUL ,  PAULSON CHARLES ANDREW ,  WESTBROOK JAMIE TODD

IPC: C03C17/00 ,  C03C17/22 ,  C03C17/245 ,  C03C21/00

Abstract: A coated glass article and methods for producing the same are provided herein. The coated glass article includes a glass body having a first surface and a second surface opposite the first surface, wherein the first surface is an exterior surface of the glass body, and a damage-resistant coating formed by atomic layer deposition, the damage-resistant coating being disposed on at least a portion of the first surface of the glass body.

公开(公告)号：SG11201704108YA

公开(公告)日：2017-06-29

申请号：SG11201704108Y

申请日：2015-11-16

Applicant: CORNING INC

Inventor： ALLINGTON ERIC LEWIS ,  BELLMAN ROBERT ALAN ,  MANLEY ROBERT GEORGE ,  MEHROTRA KARAN

IPC: B65H41/00 ,  G02F1/13 ,  H01L21/02 ,  H01L51/56

公开(公告)号：SG11201704065SA

公开(公告)日：2017-06-29

申请号：SG11201704065S

申请日：2015-11-17

Applicant: CORNING INC

Inventor： ALLINGTON ERIC LEWIS ,  SMITH TIMOTHY PAUL ,  WESTBROOK JAMIE TODD

IPC: B65G49/06

Abstract: Methods are provided for processing a first substrate with a first major surface of the first substrate removably bonded to a first major surface of a carrier substrate. Example methods include the step of controlling a bend radius of the carrier substrate while peeling the carrier substrate from the first substrate. In further examples, methods include the step of peeling a leading peripheral edge of the carrier substrate from the first substrate with an attachment member while the attachment member pivots relative to an arm. Example peeling apparatus are also provided with an arm supporting a vacuum attachment member, wherein the arm is pivotally attached to a vacuum plate.

公开(公告)号：SG10201902920SA

公开(公告)日：2019-05-30

申请号：SG10201902920S

申请日：2015-11-17

Applicant: CORNING INC

Inventor： ALLINGTON ERIC LEWIS ,  SMITH TIMOTHY PAUL ,  WESTBROOK JAMIE TODD

Abstract: APPARATUS AND METHOD OF PEELING A MULTI-LAYER SUBSTRATE Methods are provided for processing a first substrate with a first major surface of the first substrate removably bonded to a first major surface of a carrier substrate. Example methods include the step of controlling a bend radius of the carrier substrate while peeling the carrier substrate from the first substrate. In further examples, methods include the step of peeling a leading peripheral edge of the carrier substrate from the first substrate with an attachment member while the attachment member pivots relative to an arm. Example peeling apparatus are also provided with an arm supporting a vacuum attachment member, wherein the arm is pivotally attached to a vacuum plate. Fig. 1