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公开(公告)号：DK2352886T3
公开(公告)日：2014-07-28
申请号：DK09825321
申请日：2009-11-04
Applicant: CORNING INC
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Patent Agency Ranking
公开(公告)号：DK2754768T3
公开(公告)日：2016-09-12
申请号：DK14162891
申请日：2009-11-04
Applicant: CORNING INC
Inventor： GRZYBOWSKI RICHARD R , HARVEY DANIEL R , GUNOV STEPHAN L , RICOULT DANIEL L , STRELTSOV ALEXANDER M
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公开(公告)号：PL2352886T3
公开(公告)日：2014-10-31
申请号：PL09825321
申请日：2009-11-04
Applicant: CORNING INC
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公开(公告)号：WO2009011834A3
公开(公告)日：2009-03-05
申请号：PCT/US2008008609
申请日：2008-07-15
Applicant: CORNING INC , GRZYBOWSKI RICHARD R , STRELTSOV ALEXANDER M , SUTHERLAND JAMES S
Inventor： GRZYBOWSKI RICHARD R , STRELTSOV ALEXANDER M , SUTHERLAND JAMES S
IPC: G02B6/42 , C03B23/02 , C03C15/00 , C03C23/00 , G02B6/30 , G02B7/00 , H01L21/60 , H05K3/00 , H05K13/04
CPC classification number: G02B6/4226 , C03B23/0013 , C03B23/02 , C03B23/0307 , C03B2215/414 , C03C19/00 , C03C23/0025 , C03C23/007 , C03C2204/08 , G02B6/30 , G02B6/4232 , G02B6/4234 , G02B7/003
Abstract: Disclosed is a method for fabricating glass bump standoff structures of precise height, the method comprising providing oversized glass bumps on a glass substrate, providing a heat source to heat the bumps, positioning a substrate to be aligned on the oversized bumps, and reducing the height of the oversized bumps by a combination of manipulations comprising (1) softening the bumps by heating the bumps and (2) applying pressure to the substrate to be aligned.
Abstract translation: 公开了一种用于制造精确高度的玻璃凸块支座结构的方法，该方法包括在玻璃基板上提供过大的玻璃凸块，提供加热凸块的热源，将要对准的基板定位在尺寸过大的凸块上，并降低高度 （1）通过加热凸块来软化凸块，以及（2）对待对准的基板施加压力。
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公开(公告)号：EP2294020A4
公开(公告)日：2011-08-17
申请号：EP09762810
申请日：2009-05-01
Applicant: CORNING INC
Inventor： GRZYBOWSKI RICHARD R , LOGUNOV STEPHAN L , STRELTSOV ALEXANDER M
CPC classification number: C03B23/02 , C03C23/0025 , C03C2204/08 , H01L51/5268
Abstract: Raised features are formed on a transparent substrate having absorption of less than about 20% within a processing wavelength range. A portion of the substrate is irradiated with a light beam to increase the absorption of the irradiated portion of the substrate. Continued irradiation causes local heating and expansion of the substrate so as to form a raised feature on the substrate surface.
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公开(公告)号：EP2352886A4
公开(公告)日：2012-04-11
申请号：EP09825321
申请日：2009-11-04
Applicant: CORNING INC
Inventor： GRZYBOWSKI RICHARD R , HARVEY DANIEL R , LOGUNOV STEPHAN L , RICOULT DANIEL L , STRELTSOV ALEXANDER M
CPC classification number: E06B3/66304 , B23K26/0057 , B23K26/0063 , B23K26/03 , B23K26/032 , B23K26/034 , C03B23/0086 , C03B23/02 , C03B2215/414 , C03C23/0025 , E06B3/6612 , Y02A30/25 , Y02B80/24 , Y10T428/24182
Abstract: Vacuum-insulated glass (VIG) windows (10) that employ glass-bump spacers (50) and two or more glass panes (20) are disclosed. The glass-bump spacers are formed in the surface (24) of one of the glass panes (20) and consist of the glass material from the body portion (23) of the glass pane. Thus, the glass-bump spacers are integrally formed in the glass pane, as opposed to being discrete spacer elements that need to be added and fixed to the glass pane. Methods of forming VIG windows are also disclosed. The methods include forming the glass-bump spacers by irradiating a glass pane with a focused beam (112F) from a laser (110). Heating effects in the glass cause the glass to locally expand, thereby forming a glass-bump spacer. The process is repeated at different locations in the glass pane to form an array of glass-bump spacers. A second glass pane is brought into contact with the glass-bump spacers, and the edges (28F, 28B) sealed. The resulting sealed interior region (40) is then evacuated to a vacuum pressure of less than one atmosphere.
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