-
1.
公开(公告)号:WO2014096952A2
公开(公告)日:2014-06-26
申请号:PCT/IB2013/002949
申请日:2013-12-20
Inventor: SIGIRTMAC, Tayfun , KIPER, Gokhan , MEHMET ISMET CAN, Dede
CPC classification number: B23K37/0235 , B23K26/083 , B23K26/0861 , B23K26/0884 , B23K26/38 , B23Q1/445 , B23Q1/5456 , B25J9/107
Abstract: The present invention relates to a laser processing machine (10), particularly a laser cutting machine, comprising a stationary body (11), a processing bench (13) provided in a movable manner on the stationary body (11), a movable carrier body (12) connected to the stationary body (11) in a manner partially covering the bench (13), and a carrier group (20) provided on the carrier body (12) and whereon the laser head (30) is positioned.
Abstract translation: 本发明涉及一种激光加工机(10),特别涉及一种激光切割机,它包括一个固定体(11),一个以可移动的方式设置在固定体(11)上的加工台(13) (12),其以部分地覆盖所述台架(13)的方式连接到所述固定体(11);以及载体组(20),设置在所述载体主体(12)上并且所述激光头(30)定位。