公开(公告)号：JP2002164488A

公开(公告)日：2002-06-07

申请号：JP2001339775

申请日：2001-11-05

Applicant: CRAY INC

Inventor： DOLL WADE J

IPC: F28F3/12 ,  H01L23/367 ,  H01L23/473

Abstract: PROBLEM TO BE SOLVED: To optimally distribute a fluid passing through a fluid chamber of an exchanger with relative ease. SOLUTION: The heat exchanger for a semiconductor of this invention comprises a heat conduction surface located adjacent to a semiconductor chip, a circular chamber on the heat conduction surface, a plurality of heat conduction fins in the circular chamber, a fluid inlet in the center of the circular chamber and a fluid outlet in peripheral region of circular chamber. An assembly of the heat exchanger of this invention includes a semiconductor chip package, a fluid chamber having a heat conduction surface and a retainer assembly which protects the heat conduction surface against a heat source of the semiconductor chip package, wherein the fluid chamber is installed rotatably and an assembly is connected to the semiconductor chip package detachably.