ANTI-SCATTER GRIDS AND COLLIMATOR DESIGNS, AND THEIR MOTION,FABRICATION AND ASSEMBLY

    公开(公告)号:CA2437454A1

    公开(公告)日:2002-08-22

    申请号:CA2437454

    申请日:2002-02-01

    Abstract: Grids (30) and collimators, for use with electromagnetic energy emitting devices (61), include at least a metal layer that is formed, for example, by electroplating/electroforming or casting. The metal layer includes top and bottom surfaces, and a plurality of solid integrated walls (32). Each of the solid integrated walls extends from the top to bottom surface and has a plurality of side surfaces. The side surfaces of the solid integrated walls are arranged to define a plurality of openings (31) extending entirely throu gh the layer. At least some of the walls (32) also can include projections extending into the respective openings formed by the walls (32). The projections can be of various shapes and sizes, and are arranged so that a total amount of wall material intersected by a line propagating in a directi on along an edge of the grid (30) is substantially the same as another total amount of wall material intersected by another line propagating in another direction substantially parallel to the edge of the grid (30) at any distanc e from the edge. Methods to fabricate these grids (30) using copper, lead, nickel, gold, any other electroplating/electroforming materials or low melti ng temperature metals are described.

    tNTI-SCATTER GRIDS AND COLLIMATOR DESIGNS, AND THEIR MOTION, FABRICATION AND ASSEMBLY
    3.
    发明申请
    tNTI-SCATTER GRIDS AND COLLIMATOR DESIGNS, AND THEIR MOTION, FABRICATION AND ASSEMBLY 审中-公开
    tNTI散热器网格和收集器设计及其运动,制造和组装

    公开(公告)号:WO02065480A8

    公开(公告)日:2003-11-06

    申请号:PCT/US0202711

    申请日:2002-02-01

    CPC classification number: G21K1/025

    Abstract: Grids (30) and collimators, for use with electromagnetic energy emitting devices (61), include at least a metal layer that is formed, for example, by electroplating/electroforming or casting. The metal layer includes top and bottom surfaces, and a plurality of solid integrated walls (32). Each of the solid integrated walls extends from the top to bottom surface and has a plurality of side surfaces. The side surfaces of the solid integrated walls are arranged to define a plurality of openings (31) extending entirely through the layer. At least some of the walls (32) also can include projections extending into the respective openings formed by the walls (32). The projections can be of various shapes and sizes, and are arranged so that a total amount of wall material intersected by a line propagating in a direction along an edge of the grid (30) is substantially the same as another total amount of wall material intersected by another line propagating in another direction substantially parallel to the edge of the grid (30) at any distance from the edge. Methods to fabricate these grids (30) using copper, lead, nickel, gold, any other electroplating/electroforming materials or low melting temperature metals are described.

    Abstract translation: 与电磁能发射装置(61)一起使用的格栅(30)和准直器至少包括通过例如电镀/电铸或铸造形成的金属层。 金属层包括顶表面和底表面,以及多个固体一体化壁(32)。 每个固体一体化壁从顶部到底部表面延伸并且具有多个侧表面。 固体一体化壁的侧表面布置成限定完全延伸穿过该层的多个开口(31)。 至少一些壁(32)还可以包括延伸到由壁(32)形成的相应开口中的突起。 突起可以是各种形状和尺寸,并且被布置成使得沿着沿着格栅(30)的边缘的方向传播的线相交的壁材料的总量基本上与另外的总量的壁材料相交 通过在与边缘任何距离处基本上平行于栅格(30)的边缘的另一方向上传播的另一条线。 描述了使用铜,铅,镍,金,任何其它电镀/电铸材料或低熔点金属制造这些栅极(30)的方法。

    tNTI-SCATTER GRIDS AND COLLIMATOR DESIGNS, AND THEIR MOTION, FABRICATION AND ASSEMBLY
    7.
    发明公开
    tNTI-SCATTER GRIDS AND COLLIMATOR DESIGNS, AND THEIR MOTION, FABRICATION AND ASSEMBLY 审中-公开
    “TNTI杂散和格栅KOLLIMATORENTWÜRFE和你的举动,生产和组成”

    公开(公告)号:EP1364374A4

    公开(公告)日:2006-11-22

    申请号:EP02707629

    申请日:2002-02-01

    CPC classification number: G21K1/025

    Abstract: Grids (30) and collimators, for use with electromagnetic energy emitting devices (61), include at least a metal layer that is formed, for example, by electroplating/electroforming or casting. The metal layer includes top and bottom surfaces, and a plurality of solid integrated walls (32). Each of the solid integrated walls extends from the top to bottom surface and has a plurality of side surfaces. The side surfaces of the solid integrated walls are arranged to define a plurality of openings (31) extending entirely through the layer. At least some of the walls (32) also can include projections extending into the respective openings formed by the walls (32). The projections can be of various shapes and sizes, and are arranged so that a total amount of wall material intersected by a line propagating in a direction along an edge of the grid (30) is substantially the same as another total amount of wall material intersected by another line propagating in another direction substantially parallel to the edge of the grid (30) at any distance from the edge. Methods to fabricate these grids (30) using copper, lead, nickel, gold, any other electroplating/electroforming materials or low melting temperature metals are described.

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