公开(公告)号：US10693210B2

公开(公告)日：2020-06-23

申请号：US13869292

申请日：2013-04-24

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Imran Mehdi ,  Choonsup Lee ,  John J. Gill ,  Cecile D. Jung-Kubiak ,  Nuria Llombart

IPC: H01P11/00 ,  H01Q15/08 ,  H01Q19/06

Abstract: A set of antenna geometries for use in integrated arrays at terahertz frequencies are described. Two fabrication techniques to construct such antennas are presented. The first technique uses an advanced laser micro-fabrication, allowing fabricating advanced 3D geometries. The second technique uses photolithographic processes, allowing the fabrication of arrays on a single wafer in parallel.

公开(公告)号：US20200313271A1

公开(公告)日：2020-10-01

申请号：US16878207

申请日：2020-05-19

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Imran Mehdi ,  Choonsup Lee ,  John J. Gill ,  Cecile D. Jung-Kubiak ,  Nuria Llombart

IPC: H01P11/00 ,  H01Q15/08 ,  H01Q19/06

Abstract: A set of antenna geometries for use in integrated arrays at terahertz frequencies are described. Two fabrication techniques to construct such antennas are presented. The first technique uses an advanced laser micro-fabrication, allowing fabricating advanced 3D geometries. The second technique uses photolithographic processes, allowing the fabrication of arrays on a single wafer in parallel.

公开(公告)号：US11824247B2

公开(公告)日：2023-11-21

申请号：US16878207

申请日：2020-05-19

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Imran Mehdi ,  Choonsup Lee ,  John J. Gill ,  Cecile D. Jung-Kubiak ,  Nuria Llombart

IPC: H01Q15/02 ,  H01Q15/06 ,  H01P11/00 ,  H01Q15/08 ,  H01Q19/06 ,  H01Q3/34

CPC classification number: H01P11/001 ,  H01Q3/34 ,  H01Q15/08 ,  H01Q19/062 ,  Y10T29/49016

Abstract: A set of antenna geometries for use in integrated arrays at terahertz frequencies are described. Two fabrication techniques to construct such antennas are presented. The first technique uses an advanced laser micro-fabrication, allowing fabricating advanced 3D geometries. The second technique uses photolithographic processes, allowing the fabrication of arrays on a single wafer in parallel.