CLEANING OF ELECTRON-EMISSIVE ELEMENTS
    1.
    发明公开
    CLEANING OF ELECTRON-EMISSIVE ELEMENTS 有权
    清洗电子发射元件

    公开(公告)号:EP1021818A2

    公开(公告)日:2000-07-26

    申请号:EP98950613.4

    申请日:1998-09-22

    CPC classification number: H01J9/025

    Abstract: Multiple procedures are presented for removing contaminant material (12) from electron-emissive elements (10) of an electron-emitting device (30). One procedure involves converting the contaminant material into gaseous products (14), typically by operating the electron-emissive elements, that move away from the electron-emissive elements. Another procedure entails converting the contaminant material into further material (16) and removing the further material. An additional procedure involves forming surface coatings (18 or 20) over the electron-emissive elements. The contaminant material is then removed directly from the surface coatings or by removing at least part of each surface coating.

    FABRICATION AND STRUCTURE OF ELECTRON EMITTERS COATED WITH MATERIAL SUCH AS CARBON
    3.
    发明公开
    FABRICATION AND STRUCTURE OF ELECTRON EMITTERS COATED WITH MATERIAL SUCH AS CARBON 失效
    用碳等材料涂覆的电子发射体的制作和结构

    公开(公告)号:EP0968509A1

    公开(公告)日:2000-01-05

    申请号:EP98911427.7

    申请日:1998-03-23

    Abstract: A cathode structure (200, 203, 204) suitable for a flat panel display is provided with coated emitters (229, 239, 230). The emitters are formed with material, typically nickel, capable of growing to a high aspect ration. These emitters are then coated with carbon containing material (240, 241) for improving the chemical robustness and reducing the work function. One coating process is a DC plasma deposition process in which acetylene is pumped through a DC plasma reactor (301, 305, 313, and 315) to create a DC plasma for coating the cathode structure. An alternative coating process is to electrically deposit raw carbon-based material onto the surface of the emitters, and subsequently reduce the raw carbon-based material to the carbon containing material. Work function of coated emitters is typically reduced by about 0.8 to 1.0 eV.

    Abstract translation: 适用于平板显示器的阴极结构(200,203,204)设置有涂层发射器(229,239,230)。 发射体由能够生长到高纵横比的材料形成,典型地为镍。 然后用含碳材料(240,241)涂覆这些发射体,以提高化学稳定性并降低功函数。 一种涂覆工艺是DC等离子体沉积工艺,其中乙炔被泵送通过DC等离子体反应器(301,305,313和315)以产生用于涂覆阴极结构的DC等离子体。 替代的涂覆工艺是将原始的基于碳的材料电沉积到发射器的表面上,并随后将原始的基于碳的材料还原为含有碳的材料。 涂覆发射体的功函数通常降低约0.8至1.0eV。

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