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    THERMAL MANAGEMENT IN HIGH POWER RF MEMS SWITCHES
    1.
    发明申请
    THERMAL MANAGEMENT IN HIGH POWER RF MEMS SWITCHES 审中-公开
    大功率RF MEMS开关的热管理

    公开(公告)号：WO2017087336A1

    公开(公告)日：2017-05-26

    申请号：PCT/US2016/061931

    申请日：2016-11-14

    Applicant: CAVENDISH KINETICS, INC.

    Inventor： VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L.

    IPC: H01H59/00 ,  H01H1/00

    CPC classification number: H01H59/0009 ,  H01H2001/0084 ,  H01H2059/0027 ,  H01H2059/0072

    Abstract: The present disclosure generally relates to a mechanism for making a MEMS switch that can switch large electrical powers. Extra landing electrodes are employed that provide added electrical contact along the MEMS device so that when in contact current and heat are removed from the MEMS structure close to the hottest points.

    Abstract translation: 本公开总体上涉及用于制造可以切换大电功率的MEMS开关的机构。 采用额外的着陆电极，沿着MEMS器件提供增加的电接触，使得当接触电流和热量从MEMS结构接近最热点移除时。

    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE
    2.
    发明申请
    METHOD OF USING A PLURALITY OF SMALLER MEMS DEVICES TO REPLACE A LARGER MEMS DEVICE 审中-公开
    使用多个小型MEMS器件来替代大型MEMS器件的方法

    公开(公告)号：WO2010054244A2

    公开(公告)日：2010-05-14

    申请号：PCT/US2009/063616

    申请日：2009-11-06

    Applicant: CAVENDISH KINETICS, INC. ,  SMITH, Charles Gordon ,  KNIPE, Richard L. ,  JOSHI, Vikram ,  GADDI, Roberto ,  UNAMUNO, Anartz ,  VAN KAMPEN, Robertus Petrus

    Inventor： SMITH, Charles Gordon ,  KNIPE, Richard L. ,  JOSHI, Vikram ,  GADDI, Roberto ,  UNAMUNO, Anartz ,  VAN KAMPEN, Robertus Petrus

    IPC: B81C1/00

    CPC classification number: B81B7/04 ,  B81B2201/0221 ,  B81B2201/0235 ,  B81B2207/053 ,  G01P15/0802 ,  G01P15/125 ,  G01P15/135 ,  H01G5/18 ,  H01G5/40

    Abstract: Embodiments disclosed herein generally include using a large number of small MEMS devices to replace the function of an individual larger MEMS device or digital variable capacitor. The large number of smaller MEMS devices perform the same function as the larger device, but because of the smaller size, they can be encapsulated in a cavity using complementary metal oxide semiconductor (CMOS) compatible processes. Signal averaging over a large number of the smaller devices allows the accuracy of the array of smaller devices to be equivalent to the larger device. The process is exemplified by considering the use of a MEMS based accelerometer switch array with an integrated analog to digital conversion of the inertial response. The process is also exemplified by considering the use of a MEMS based device structure where the MEMS devices operate in parallel as a digital variable capacitor.

    Abstract translation: 本文公开的实施例通常包括使用大量的小MEMS器件来代替单个更大的MEMS器件或数字可变电容器的功能。 大量较小的MEMS器件具有与较大器件相同的功能，但是由于尺寸较小，因此可以使用互补金属氧化物半导体（CMOS）兼容工艺封装在腔中。 通过大量较小器件的信号平均，允许较小器件阵列的精度等同于较大的器件。 通过考虑使用具有惯性响应的集成模数转换的基于MEMS的加速度计开关阵列来举例说明该过程。 还通过考虑使用MEMS器件结构（其中MEMS器件并行地作为数字可变电容器）来使用该过程。

    VARIABLE CAPACITOR COMPRISING MEMS DEVICES FOR RADIO FREQUENCY APPLICATIONS
    5.
    发明申请
    VARIABLE CAPACITOR COMPRISING MEMS DEVICES FOR RADIO FREQUENCY APPLICATIONS 审中-公开
    包含用于无线电频率应用的MEMS器件的可变电容器

    公开(公告)号：WO2014025844A1

    公开(公告)日：2014-02-13

    申请号：PCT/US2013/053888

    申请日：2013-08-07

    Applicant: CAVENDISH KINETICS, INC

    Inventor： VAN KAMPEN, Robertus Petrus ,  KNIPE, Richard L.

    IPC: H01L27/01 ,  B81B7/04 ,  H01L23/66 ,  H01L23/00 ,  H01L27/08 ,  H01L49/02 ,  B81B3/00 ,  H01G5/16 ,  H01G5/18 ,  H01G5/38 ,  H01L27/02

    CPC classification number: H01G5/16 ,  H01G5/18 ,  H01G5/38 ,  H01L27/01 ,  H01L27/0207 ,  H01L27/0805 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/19104 ,  H01L2924/0001

    Abstract: A variable capacitor (300) comprises cells (200, 400) that have an RF electrode (202, 402) coupled to a bond pad (30). Each cell comprises a plurality of MEMS devices (100) the capacitance of which can be changed by means of a movable electrode. The MEMS devices are placed in a sealed cavity of the cell and are arranged next to each other along the length of the RF electrode of the cell. The RF electrode of each cell can be trimmed so as to obtain an RF line (402) and a further ground electrode (404) and so as to scale the RF capacitance of the cell without impacting the mechanical performance of the MEMS cells. Each cell has the same control capacitance irrespective of the RF capacitance. This allows each cell to use the same isolation resistor required for RF operation and thus each cell has the same parasitic capacitance. This allows the CMOS control circuit to be optimized and the dynamic performance of the cells to be matched.

    Abstract translation: 可变电容器（300）包括具有耦合到接合焊盘（30）的RF电极（202,402）的电池（200,400）。 每个单元包括多个MEMS器件（100），其电容可以通过可移动电极来改变。 MEMS器件被放置在电池的密封空腔中并且沿着电池的RF电极的长度彼此相邻地布置。 可以对每个单元的RF电极进行修整，以获得RF线（402）和另外的接地电极（404），以便在不影响MEMS单元的机械性能的情况下缩放电池的RF电容。 每个单元都具有与RF电容无关的相同的控制电容。 这允许每个单元使用RF操作所需的相同的隔离电阻，因此每个单元具有相同的寄生电容。 这允许CMOS控制电路被优化并且电池的动态性能匹配。

    PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE
    9.
    发明申请
    PULL UP ELECTRODE AND WAFFLE TYPE MICROSTRUCTURE 审中-公开
    拉起电极和WAFFLE型微结构

    公开(公告)号：WO2012040092A1

    公开(公告)日：2012-03-29

    申请号：PCT/US2011/052118

    申请日：2011-09-19

    Applicant: CAVENDISH KINETICS, INC ,  KNIPE, Richard L. ,  VAN KAMPEN, Robertus Petrus ,  UNAMUNO, Anartz ,  GADDI, Roberto

    Inventor： KNIPE, Richard L. ,  VAN KAMPEN, Robertus Petrus ,  UNAMUNO, Anartz ,  GADDI, Roberto

    IPC: H01H1/00 ,  H01H59/00

    CPC classification number: H01H1/0036 ,  H01H59/0009 ,  H01H2001/0084

    Abstract: The present invention generally relates to MEMS devices and methods for their manufacture. The cantilever of the MEMS device may have a waffle-type microstructure. The waffle-type microstructure utilizes the support beams to impart stiffness to the microstructure while permitting the support beam to flex. The waffle-type microstructure permits design of rigid structures in combination with flexible supports. Additionally, compound springs may be used to create very stiff springs to improve hot-switch performance of MEMS devices. To permit the MEMS devices to utilize higher RF voltages, a pull up electrode may be positioned above the cantilever to help pull the cantilever away from the contact electrode.

    Abstract translation: 本发明一般涉及MEMS器件及其制造方法。 MEMS器件的悬臂可以具有华夫饼型微结构。 华夫饼形微结构利用支撑梁来赋予微结构刚度，同时允许支撑梁弯曲。 华夫饼型微结构允许将刚性结构与柔性支撑结合在一起。 此外，可以使用复合弹簧来产生非常硬的弹簧以改善MEMS装置的热开关性能。 为了允许MEMS器件利用更高的RF电压，可以将上拉电极定位在悬臂上方以帮助将悬臂从接触电极拉出。

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