公开(公告)号：US20200068754A1

公开(公告)日：2020-02-27

申请号：US16548715

申请日：2019-08-22

Applicant: Chung-Lin WANG

Inventor： Chung-Lin WANG

IPC: H05K13/02 ,  H01L33/00 ,  H05K13/04

Abstract: The present invention provides a method of arranging a huge amount of chips, comprising the sequential steps: a providing step of providing a substrate and a plurality of chips; a spreading step of spreading a plurality of chips on the surface of the substrate; a tilting step of tilting the substrate by an angle to slide down the plurality of chips along the surface of the substrate so that the trapping stoppers trap the plurality of chips respectively in such a manner that the blocked chips are placed in the chip placing areas respectively; an adhering step of adhering, onto the chip placing areas, the chips with the working surface upward; and a removing step of removing, from the substrate, the chips which are not adhered onto the chip placing areas. A huge number of chips can be transferred efficiently by the method of the present invention.